Microfocus X Ray
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Microfocus X Ray Inspection Machine Zamknij rurkę 5KW do baterii litowej
Cabinet Lithium Battery Automatic X-ray Inspection Machine AX8800 Applications: ●Lithium battery pole piece solder joint defect detection, ●Lithium battery batteries coiling case detection, ●BGA , CSP , LED , Flip Chip , Semiconductor, ●Battery Industry , Small Metal Casting, ●Electronic Connector Module, ●Aerospace Components , Photovoltaic Industry , ●Other Special Industries. Aftersales service: Ø A professional service team Ø Country-wide network Ø 24/7 hotline Ø Onsite
Unicomp systemu kontroli rentgenowskiej Microfocus dla przemysłu spożywczego
UNX4015N X-Ray system for ham sausage/jerky/nuts foreign matters inspection Application UNX4015-N is used to detect foreign matter contaminants in small bags for lightweights products. Such as candy, fresh meat, prawn, vegetable, poultry, chocolates, candy, pasta, instant noodles, bread, biscuits, dried fish, ham sausage, beef jerky, nuts, etc. Specificaitions Equipment Features Dimension 1168(W)X985(D)X1510(H)mm Machine weight 500kg X-ray tube 80-120kv/210-480W Power Supply
System rentgenowski z mikrofokusem 90KV 5um z FPD o wysokiej rozdzielczości do sprawdzania pustek lutowniczych PCBA BGA
90KV 5um microfocus X-ray system with high resolution FPD for PCBA BGA soldering void checking Specifications of SMT Xray machine: System Summary Footprint 1200(W)×1200(D)×1500(H)mm Machine Weight 1130 kg Power Supply AC 110/220V, 50/60Hz Plywood Packing Size 1350(W)×1350(D)×1800(H)mm Packing Weight 1330 kg Power Consumption 1.3kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD) Pixel
Prześwietlenie mikrofokusowe 130kV Unicomp AX9100 do kontroli lutowania SMT PCBA BGA
130kV microfocus X-ray of Unicomp AX9100 for SMT PCBA BGA soldering Inspection Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery
Offline 5um microfocus X-ray maszyna AX8200B do kontroli niewspółosiowości uzwojenia cewki baterii litowej
Offline 5um microfocus X-ray machine AX8200B for Lithium Battery cell coil winding misalighment inspection The lithium battery X-Ray detection equipment of multiple types and full automation solely-developed by Unicomp Technology is targetted to inspect cells alignment metric and tabs soldering quality . It improves automation as well as gains high-definition internal images by means of X-ray imaging technology . This technology is widely applied to the detection of lithium
Aparat rentgenowski Unicomp microfocus do kontroli jakości litowych ogniw guzikowych TWS
Unicomp microfocus X Ray Machine for TWS Lithium Button Cell Quality Check Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery
RTG 5μm Microfocus z odchyleniem FPD o 55° w celu sprawdzenia pustki lutowniczej LED PCBA BGA QFN
5μm Microfocus X-ray with FPD 55° tilting view to inspect PCBA BGA QFN LED soldering void Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD) Pixel
Pomiar szczeliny lutowniczej SMT BGA Urządzenie rentgenowskie Microfocus 130kV
130kV 7 μm Microfovus X-Ray Machine For SMT BGA Soldering Void Measurement Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Features: ● 1000X magnification, high-definition real-time image. ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● One
Microfocus AX8200 Maszyna do kontroli rentgenowskiej Unicomp 5um Najnowocześniejsze oprogramowanie
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 Item Definition Specs System Parameters Size 1080(L)x1180(W)x1730(H)mm Weight 1150kg Power 220AC/50Hz Power Consumption 0.8kW X-ray Tube Type Closed Max.Voltage 90kV/100kV Max.Power 8W Spot Size 5μm X-ray System Intensifier 4"Image Intensifier Monitor 22"LCD System Magnification 600x Detection Region Max.Loading Size 510mm x 420mm Max.Inspection Area 435mm x 385mm X-ray Leakage < 1uSv/h Applications
