Elektronika X Ray Machine
Uszczelniona rura 90 kV 5 μm Kabel wiązki przewodów Micro Focus Wada wewnętrzna Maszyna kontrolna Xray AX7900 Unicomp
90kV Sealed Tube 5μm Micro Focus Wire Harness Cable Internal Defect Xray Inspection Machine AX7900 Unicomp Description: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase...
CSP Electronics X Ray Machine UNICOMP CX3000 do złącza kablowego
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 Applications BGA Inspection Inspection of over molded electrical connectors Encapsulated components Aluminum die castings Molded plastic components Ceramics Aerospace components Electrical / mechanical components Electronic ...
CSP LED 5um Maszyna do kontroli rentgenowskiej Microfocus AX8200 z mapowaniem CNC
Unicomp 5um Microfocus AX8200 X Ray Inspection Machine For Automotive Electronics quality control with CNC mapping Applications: BGA , CSP , LED , Flip Chip , Semiconductor, Battery Industry , Small Metal Casting, Electronic Connector Module, Aerospace Components , Photovoltaic Industry, The AX-8200 ...
EMS SMT Electronics X Ray Machine 90kV FPD Detektor Unicomp
EMS SMT Electronics X Ray Machine 90kV FPD Detector Unicomp Original manufacturer SMT Equipment Electronics X Ray Machine on IC chips wire Analysis Specifications of Xray machine: System Summary Footprint 1200(W)×1200(D)×1500(H)mm Machine Weight 1130 kg Power Supply AC 110/220V, 50/60Hz Plywood ...
22-calowy aparat rentgenowski Unicomp AX8200B Electronics do polimerowej baterii litowej
Smt X-ray Closed 5g Chipset Electronic Connector Module Inspection Machine AX8200 Applications: BGA , CSP , LED , Flip Chip , Semiconductor, Battery Industry , Small Metal Casting, Electronic Connector Module, Aerospace Components , Photovoltaic Industry, The AX-8200 machine is designed to provide ...
Przemysłowa maszyna do kontroli rentgenowskiej 130KV do wykrywania BGA, PCBA i lutowania AX9100MAX UNICOMP
130KV Industrial X-ray Inspection Machine for BGA, PCBA and Solder Voiding Detection AX9100MAX UNICOMP This system sees extensive deployment across diverse inspection scenarios including BGA, CSP, flip chip, LED, fuses, diodes, PCBs, discrete semiconductors, lithium batteries, miniature metal ...
Wysoka precyzja ruchu 5 µm Mikroogniskowe rentgenowskie urządzenie do kontroli jakości elektroniki BGA QFN AX7900 Unicomp
High Motion Precision 5μm Micro Focus BGA QFN Electronics X-ray Equipment AX7900 Automatic X-ray Mapping Inspection for IC Electronics Components Advanced X-ray inspection system for internal quality assessment and counterfeit detection of electronic components. System Overview The AX7900 features a ...
Rentgenowski aparat inspekcyjny Unicomp AX8300H z mikogniskowym źródłem rentgenowskim 110kV i detektorem FPD o wysokiej rozdzielczości
Inspekcja rentgenowska AX8300H ze źródłem mikrofokusa 110 kV i obrotem 360°. Detekcja FPD o wysokiej rozdzielczości do analizy BGA, CSP i półprzewodników. Spełnia standardy bezpieczeństwa FDA przy wycieku <1μSv/h.
Unicomp X-ray AX8300MAX Półprzewodnikowy sprzęt do kontroli rentgenowskiej z mikrofokusem
Unicomp X-ray AX8300MAX Semiconductor Microfocus X-ray Inspection Equipment Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features 1. Dedicated semiconductor, resolution 5 µm 2...
