Elektronika X Ray Machine
7μm obrazowanie IC Bonding przerwanie drutu Xray AX9100 UNICOMP sprzęt do testowania opakowań chipów półprzewodnikowych
7μm Imaging IC Bonding Wire Break Xray AX9100 UNICOMP Semiconductor Chip Packaging Testing Equipment Advanced X-ray inspection system designed for comprehensive defect detection in electronic components and industrial applications. Key Features 130KV 7μm X-Ray tube for precise imaging High speed & ...
Detekcja obrotowa Precyzyjne powiększenie geometryczne Produkcja chipów Rentgen UNICOMP AX9100 LED
UNICOMP AX9100 X-ray Inspection System Rotary Detection Precise Geometric Magnification Chip Production X-ray UNICOMP AX9100 IC Inspection System Key Features 130KV 7μm X-Ray tube for precise imaging High speed & millions pixels high resolution FPD 1600X magnification with high-definition real-time ...
Maszyna rentgenowska PCB o wysokim powiększeniu Unicomp AX9100MAX do kontroli drutu wiązania komponentów elektronicznych IC
High Magnifications PCB X-Ray Machine Unicomp AX9100MAX Advanced X-ray inspection system for electronics IC components and bonding wire analysis with high precision non-destructive testing capabilities. This system is widely deployed for high-precision non-destructive inspection across extensive ...
Programowalna automatyczna kontrola CNC Elektronika Aparat rentgenowski Unicomp AX9100MAX do pomiaru krzywizny układu scalonego
CNC Programmable Automatic Inspection Electronics X-ray Machine Unicomp AX9100MAX Optimized for high-precision non-destructive testing of semiconductors and electronics, the AX9100MAX provides comprehensive inspection capabilities for IC curvature measurement and various electronic components. ...
Urządzenie rentgenowskie SMT PCB o wysokiej rozdzielczości mikronów, rozmiar plamki ogniskowej Unicomp AX9100MAX do pomiaru pustych przestrzeni BGA
SMT PCB X-ray Machine - Unicomp AX9100MAX High-resolution micron focus spot size X-ray system optimized for BGA voids measurement and comprehensive non-destructive testing of semiconductors and electronic components. Applications BGA, CSP, flip chips, LED packages, fuses, power diodes, multilayer ...
130KV mikronowa maszyna rentgenowska z wbudowaną kropką w celu kontroli PCB BGA
Unicomp AX9100MAX X-Ray Inspection System 130KV micron focus spot size tube X-ray machine with dual computers for high-precision PCB and BGA inspection. Optimized for non-destructive testing of semiconductors and electronics, providing comprehensive inspection capabilities for IC curvature ...
Tablice elektroniczne o wysokich parametrach Aparat rentgenowski 2D 2,5D Unicomp AX9100MAX ze stołem obrotowym 360 stopni
High Specifications Electronic Boards 2D 2.5D X-ray Machine Unicomp AX9100MAX 130KV micron focus spot size tube X-ray machine Unicomp AX9100 with dual computers for PCB BGA inspection. Optimized for high-precision non-destructive testing of semiconductors and electronics, the AX9100MAX provides ...
Unicomp AX8300 Sprzęt Xray do kontroli jakości Automatyczne wykrywanie pustych przestrzeni Wysoka precyzja ruchu BGA
Unicomp AX8300 X-ray Inspection System The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT, and electronic component manufacturing. Featuring a proprietary 110kV micro-focus X-ray source, it provides balanced ...
System kontroli jakości złącza lutowniczego BGA o wysokiej precyzji Xray AX8300 Sprzęt Unicomp
High Precision BGA Solder Joint X-ray Quality Control System AX8300 The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV micro-focus X-ray ...
