logo
Witamy na Unicomp Technology
+86-13502802495
ZNALEZIONY 232 produkty dla "

bga inspection equipment

"
Jakość Oświetlenie pojazdu Unicomp X Ray 60 ° Ruch pochylenia z funkcją CNC fabryka

Oświetlenie pojazdu Unicomp X Ray 60 ° Ruch pochylenia z funkcją CNC

EMS Semiconductor Unicomp X-Ray Inspection System Electronics BGA AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework

Jakość BGA QFN Unicomp X Ray Inspection System 130KV z ruchem 6 osi fabryka

BGA QFN Unicomp X Ray Inspection System 130KV z ruchem 6 osi

CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 1600 X Detection Region Max.Loading Size Φ570mm Max.Inspection Area 450mm x 450mm X-ray Leakage

Jakość HD FPD Electronics X Ray Maszyna 1,3 kW do układów scalonych Semicon fabryka

HD FPD Electronics X Ray Maszyna 1,3 kW do układów scalonych Semicon

HD FPD Electronics X Ray Machine 1.3kW For Semicon IC Chips Microfocus X Ray machine with HD FPD for semicon IC chips wire sweep broken defect Inspection Specifications of Xray machine: System Summary Footprint 1200(W)×1200(D)×1500(H)mm Machine Weight 1130 kg Power Supply AC 110/220V, 50/60Hz Plywood Packing Size 1350(W)×1350(D)×1800(H)mm Packing Weight 1330 kg Power Consumption 1.3kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm

Jakość Sprzęt rentgenowski o wysokiej rozdzielczości 5um do produkcji fabrycznej przełączników elektrycznych Unicomp fabryka

Sprzęt rentgenowski o wysokiej rozdzielczości 5um do produkcji fabrycznej przełączników elektrycznych Unicomp

Unicomp Factory Manufacturing 5μm High Resolution X-ray Equipment for Electric Switch Technical Specifications of AX7900 Item Definition Specs System Parameters Size 1100(L)x1100(W)x1500(H)mm Weight 1000kg Power 220AC/50Hz Power Consumption 0.8kW X-ray Tube Type Closed Max.Voltage 80kV/90kV Max.Power 12W/8W Spot Size 5μm/15μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 160 X/360X Detection Region Max.Loading Size 440mm x 400mm Max.Inspection Area 420mm

Jakość Elektronika Unicom X-Ray Machine do wykrywania defektów na półprzewodnikowych powierzchniach płytek fabryka

Elektronika Unicom X-Ray Machine do wykrywania defektów na półprzewodnikowych powierzchniach płytek

EMS Semiconductor Unicomp PCB X Ray Machine for Electronics BGA AX8200​ X-ray inspection system has been widely applied to Circuit Board Inspection,Semi-Conductor Inspection and Other Applications. (Offline X - Ray series) widely used in offline detection, defect analysis, used for PCBA, packaging, ceramics, plastics, LED, and so on. The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is

Jakość Unicomp AX8500 110kV 5um 2.5D RTG dla elektroniki SMT PCBA BGA IC kontrola jakości lutowania fabryka

Unicomp AX8500 110kV 5um 2.5D RTG dla elektroniki SMT PCBA BGA IC kontrola jakości lutowania

Unicomp AX8500 110kV 5um 2.5D X-ray for Electronics SMT PCBA BGA IC soldering quality check Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD)

Jakość Chipset Lead frame Wewnętrzna kontrola jakości przez Unicomp 5um zamknięta rura AX7900 X Ray Machine fabryka

Chipset Lead frame Wewnętrzna kontrola jakości przez Unicomp 5um zamknięta rura AX7900 X Ray Machine

Chipset Lead frame Inner Quality Inspection by Unicomp 5um closed tube AX7900 X Ray Machine Description: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading area 420mm

Jakość Wykrywanie jakości wiązek przewodów AX7900 Electronics Unicomp X Ray Equipment fabryka

Wykrywanie jakości wiązek przewodów AX7900 Electronics Unicomp X Ray Equipment

Wire Harness Quality Detection AX7900 Electronics Unicomp X Ray Equipment Description of IC X-Ray machine AX7900: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading

Jakość Mikrofocus Unicomp Pcb X Ray Inspection Machine 1080mmx1180mmx1730mm fabryka

Mikrofocus Unicomp Pcb X Ray Inspection Machine 1080mmx1180mmx1730mm

Unicomp X-ray Machine Electronics LED BGA Standard Multipurpose Features: ● 100KV 5μm X-ray tube, image intensifier with 2 mega pixels CCD camera. ● Motion controls include: ±60° tilt motion, X/Y table motion plus Z axis tube and detector movement. ● Multi-function DXI image processing system ● X/Y programming function for multiple image inspection routines ● Max. loading area 510mm x 420mm, max. detection area 435 x 385mm with ~300X System Magnification. BGA void/area auto