electronics x ray system
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Unicomp SMD Chip Counter X Ray quad bęben i taca JEDEC z dynamicznym algorytmem AI i obsługą chmury
Unicomp SMD Chip Counter X Ray quad reel and JEDEC tray with dynamic AI algorithm and Cloud support Main Configuration 1. Bar-code Scanner 2. X-ray System 3. Label Printer 4. Finger Printer Recognition System Equipment Features Footprint (W*D*H) / Machine Weight 1000 mm*1370 mm*1962 mm / 1160 kg Package Plywood Case, 110 cm*145 cm*210 cm, Total 1450 kg Power Consumption 1.1 kW Power Supply AC 110~220V (±10%) 50Hz Working Mode Off-line System Computer Operating System
SMT BGA X Ray Detection Equipment Flip Chip FPD Detector 130KV For Semicon
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries. Features 130kV (Option 110KV) 7µm closed X-ray tube, high speed & Millions pixels high resolution FPD X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Multi-function DXI image
W systemie kontroli bagażu Linex Ray Tryb sterowania ruchem CNC do oświetlenia LED
In-line X-Ray Inspection Machine for LED Lighting Unicomp Technology upholds its Integrity, Deploitation and Excellence in the business, is committed to meeting the highest level of International Standards and promises to be a responsive partner with all of our customers. This philosophy has enabled Unicomp to generated a strong Global customer base of many International Renowned companies including Flextronics, Foxconn, Samsung, Philips, GM, Bosch, Emerson, Delphi,ABB, BYD,
FPD 130kV X Ray Inspection Machine do podgrzewacza kasetowego
Application Widely applied for BGA , CSP , Flip Chip, LED , Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55° and rotation 360°operation together with 6 axis movement X-ray tube & detector automatic lifting and descending, with convenient target point
SMT BGA Inspection X Ray Chip Counter 440mm Tunnel CE
Features ● Automatic inspection, no need on programs switch for different components ● Fast speed and high accurate chip counting, reducing labor costs ● No chip damage or lost with non-destructive counting ● Compatible with 7”~17” tape & reels ● Automatic link with ERP & MES System, and storage system ● Shielded cabinet protection to guarantee Safety leakage of X-ray ● Fast counting Speed:12~13s/Reel ● Inspection Accuracy: ≥99.9% ● Min. Package: 01005 ● One-button operation,
X-ray licznik chipów SMD CX7000L 1,1 kW z integracją bazy danych magazynu ERP MES
Unicomp CX7000L X-ray for SMD Chip Counter with ERP MES warehouse database integration Main Configuration 1. Bar-code Scanner 2. X-ray System 3. Label Printer 4. Finger Printer Recognition System Equipment Features Footprint (W*D*H) / Machine Weight 1000 mm*1370 mm*1962 mm / 1160 kg Package Plywood Case, 110 cm*145 cm*210 cm, Total 1450 kg Power Consumption 1.1kW Power Supply AC 110~220V (±10%) 50Hz Working Mode Off-line System Computer Operating System Industrial PC, Windows
Półprzewodnikowy licznik chipów X Ray 440 mm Tunel CX7000L do pakietu rur z czterema szpulami
China factory supply of SMD component counter X-ray CX7000L for quad reel, JEDEC Tray, Tube package Main Configuration 1. Bar-code Scanner 2. X-ray System 3. Label Printer 4. Finger Printer Recognition System Equipment Features Footprint (W*D*H) / Machine Weight 1000 mm*1370 mm*1962 mm / 1160 kg Package Plywood Case, 110 cm*145 cm*210 cm, Total 1450 kg Power Consumption 1.1 kW Power Supply AC 110~220V (±10%) 50Hz Working Mode Off-line System Computer Operating System
Aluminiowa maszyna do wykrywania promieni X NDT Aerospace Automotive Parts UNC130
Aluminum NDT X ray Detection Machine Aerospace Automotive Parts UNC130 Features: ● 130kV,20μm X-ray tube, FPD; ● Multi-function workstation with 360°"ARC" motion and shift; ● C-arm fixture design enabling five-axis motion detection(Auto lift and descend); ● User friendly software design for easy interfacing can facilitate,customized software; ● Max. detection area Φ300*500mm. Applications: ● Precise casting parts and parts for Automobile ● Crop,Ceramics and Metal parts ●
Analiza lutowania metodą lutowania SMT / EMS X Ray Machine, systemy kontroli przemysłowej
Metal X Ray Machine Solder reflow analysis for PCB / BGA / LED X-ray detection technology for the SMT production testing means brought new changes, it can be said that it is the desire to further improve the level of production technology to improve the quality of production, and will soon find the circuit assembly failure as a breakthrough. It's the best selection for the manufacturer. Item Definition Specs System Parameters Size 1080(L)x1180(W)x1730(H)mm Weight 1150kg Power
