electronics x ray system
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Unicomp AX9100max X-ray Machine High-Performance for IGBT Inspection in Various Industries
Unicomp AX9100max X-ray Machine High-Performance for IGBT Inspection in Various Industries Unicomp AX9100max X-ray Machine 130kV 65W FOR BGA Unicomp AX9100max X-ray Machine The AX9100max is a high-performance X-ray inspection system specially designed for IGBT inspection and other advanced applications. It is widely used across multiple industries, including: Semiconductors: BGA, CSP, Flip Chip, Diode, IGBT Electronics: LED, PCB, Fuse, Connector Modules, Cables Energy & Power
Unicomp AX9100max X-ray Machine 130kV For IGBT Testing
Unicomp AX9100max X-ray Machine 130kV For IGBT Testing The Unicomp AX9100max X-ray Machine is designed for IGBT inspection and widely applied in various industries including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, and Photovoltaic Industry. Application Fields Functions and Features Inspection Image Technical Parameters and Specifications Dimensions and Appearance
160KV Automotive X Ray Inspection Machine Przemysłowe rozwiązania techniczne
160KV Automotive X Ray Inspection Machine Industrial Technical Solutions Unicomp Technology X-Ray inspection systems division offers state of the art X-ray cabinet systems with the highest performance to price ratio in the industry today. Unicomp has over 15years of experience selling solutions as a leading NDT (non-destructive test) supplier of x-ray inspection equipment into the electronic, materials, and biological markets. Our advanced x-ray systems feature high power
Urządzenia Inline NDT X Ray 2.8LP / Mm Detect Systemy testowania / kontroli dla piasty koła
Inline X-Ray Testing & Inspection Equipment & Systems for wheel hub Unicomp Technologies is a global supplier of innovative solutions for x-ray inspection and non-destructive testing (NDT). The unicomp systems are based on leading-edge x-ray and vision technology and ensure the fulfilment of customers' quality requirements. Unicomp Technologies’ product portfolio encompasses real-time failure analysis, including standardised systems for manual and automatic x-ray inspection,
Stand Alone Void BGA X Ray Inspection Machine DXI Image Processing System 40W
Application Aluminium Die-casting, Moulding Plastic. Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Ceramics, other special industries. Features X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Tilt detection with 55° and rotation 360°operation together with 6 axis movement Multi-function DXI image processing system,
Odlew aluminiowy SMT / EMS Maszyna rentgenowska CNC Programowalna detekcja pustek BGA
Application Aluminium Die-casting, Moulding Plastic. Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. SMT, BGA, CSP, Flip Chip, LED Detection Features X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Multi-function DXI image processing system, CNC programmable detection 130kV (Option 110KV) 3µm closed X-ray tube, high speed &
Odlewanie aluminium obręczy koła on-line System rentgenowski NDT Radiograpy do wykrywania porowatości i pęknięć
Inline X-Ray Testing & Inspection Equipment & Systems for wheel hub Unicomp Technologies is a global supplier of innovative solutions for x-ray inspection and non-destructive testing (NDT). The unicomp systems are based on leading-edge x-ray and vision technology and ensure the fulfilment of customers' quality requirements. Unicomp Technologies’ product portfolio encompasses real-time failure analysis, including standardised systems for manual and automatic x-ray inspection,
Unicomp AX8200MAX Sprzęt do kontroli rentgenowskiej półprzewodników
Unicomp AX8200 X Ray Inspection Equipment For Semiconductor Unicomp AX8200Max microfocus X-ray Inspection System for Semiconductor BGA IC Cable & wires qualtiy inspection Specification Of SMT X Ray machine System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)×155(D)×200(H)cm Packing Weight 1500 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable)
160KV Inline NDT X Ray Maszyna Radiografia NDT Sprzęt do kół aluminiowych
Unicomp Technology 160KV Inline NDT X-Ray Radiograpy system for aluminum wheel casting inspection Technical Data X-Ray Machine Dimensions:5430mmx2050mmx2410mm(L*W*H) Weight: 5T Detection range: 13~26" Load weight: 50KG Work environment: 5-40° ≦85﹪HR Install power: 380V±10％ 50HZ X-Ray Tube Voltage : 160KV Power: 800W/1800W Focal Spot Size: 0.5mm FPD Detector Detector Size: 250mm×300mm Pixel matrix: 1792mm*2176mm Pixel size: 139μm Frame rate: 9 fps(1x1)30 fps(2 x 2) Unicomp
