logo
Witamy na Unicomp Technology
+86-13502802495
ZNALEZIONY 864 produkty dla "

industrial inspection systems

"
Jakość Wysoka precyzja ruchu 5 µm Mikroogniskowe rentgenowskie urządzenie do kontroli jakości elektroniki BGA QFN AX7900 Unicomp fabryka

Wysoka precyzja ruchu 5 µm Mikroogniskowe rentgenowskie urządzenie do kontroli jakości elektroniki BGA QFN AX7900 Unicomp

High Motion Precision 5μm Micro Focus BGA QFN Electronics X-ray Equipment AX7900 Automatic X-ray Mapping Inspection for IC Electronics Components Advanced X-ray inspection system for internal quality assessment and counterfeit detection of electronic components. System Overview The AX7900 features a 90KV 5μm X-ray tube with FPD detector, multi-function workstation, and comprehensive motion control system. The system includes XY multi-axis movement with ±60° tilt motion option

Jakość Aparat rentgenowski Unicomp offline AX7900 z automatycznym mapowaniem i lutowaniem BGA QFN LED Automatyczny pomiar pustki fabryka

Aparat rentgenowski Unicomp offline AX7900 z automatycznym mapowaniem i lutowaniem BGA QFN LED Automatyczny pomiar pustki

Unicomp offline AX7900 X-ray machine with auto-mapping and BGA QFN LED soldering Void auto measurement Specifications of Unicomp offline AX7900 X-ray machine: System Summary Footprint 1200(W)×1200(D)×1500(H)mm Machine Weight 1130 kg Power Supply AC 110/220V, 50/60Hz Plywood Packing Size 1350(W)×1350(D)×1800(H)mm Packing Weight 1330 kg Power Consumption 1.3kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat

Jakość System rentgenowski z mikrofokusem 90KV 5um z FPD o wysokiej rozdzielczości do sprawdzania pustek lutowniczych PCBA BGA fabryka

System rentgenowski z mikrofokusem 90KV 5um z FPD o wysokiej rozdzielczości do sprawdzania pustek lutowniczych PCBA BGA

90KV 5um microfocus X-ray system with high resolution FPD for PCBA BGA soldering void checking​ Specifications of SMT Xray machine: System Summary Footprint 1200(W)×1200(D)×1500(H)mm Machine Weight 1130 kg Power Supply AC 110/220V, 50/60Hz Plywood Packing Size 1350(W)×1350(D)×1800(H)mm Packing Weight 1330 kg Power Consumption 1.3kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD) Pixel

Jakość System wykrywania promieniowania rentgenowskiego jakości lutownicy dla lampy LED pojazdów fabryka

System wykrywania promieniowania rentgenowskiego jakości lutownicy dla lampy LED pojazdów

EMS Semiconductor Unicomp X-Ray Inspection System Electronics BGA AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework

Jakość Urządzenie do promieniowania rentgenowskiego Unicomp AX7900 Do EMS SMT PCBA BGA QFN CSP fabryka

Urządzenie do promieniowania rentgenowskiego Unicomp AX7900 Do EMS SMT PCBA BGA QFN CSP

CE FDA compliance x ray machine Unicomp AX7900 for EMS SMT PCBA BGA QFN CSP soldering Void checking Description: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading

Jakość Unicomp 5um 90KV X Ray z ukośnym widokiem FPD do kontroli zamiatania drutu Semicon IC fabryka

Unicomp 5um 90KV X Ray z ukośnym widokiem FPD do kontroli zamiatania drutu Semicon IC

Unicomp 5um 90KV X Ray with FPD oblique view for Semicon IC wire bonding sweeping check Specifications of Xray machine: System Summary Footprint 1200(W)×1200(D)×1500(H)mm Machine Weight 1130 kg Power Supply AC 110/220V, 50/60Hz Plywood Packing Size 1350(W)×1350(D)×1800(H)mm Packing Weight 1330 kg Power Consumption 1.3 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD) Pixel Size 85μm

Jakość Spawarka półprzewodnikowa o wysokiej rozdzielczości 90KV 5um fabryka

Spawarka półprzewodnikowa o wysokiej rozdzielczości 90KV 5um

90kV 5um High Resolution And Long Lifespan X-Ray Machine For SMD PCBA Soldering Qualtiy Inspection​ The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and

Jakość PCBA BGA LED QFN X Ray Skaner Unicomp AX7900 do półprzewodników fabryka

PCBA BGA LED QFN X Ray Skaner Unicomp AX7900 do półprzewodników

High resolution micofocus X-Ray machine Unicomp AX7900 for SMT EMS PCBA BGA LED QFN soldering Void quality check Description: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max

Jakość CSP LED Stołowa maszyna rentgenowska 0.8KW System Unicomp AX7900 DXI fabryka

CSP LED Stołowa maszyna rentgenowska 0.8KW System Unicomp AX7900 DXI

Venous Indwelling needle inside assembly quality inspection by Unicomp AX7900 X-ray machine Description: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading area 420mm