metal x ray machine
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Cyfrowy sprzęt do radiografii NDT Unicomp UNC160 X Ray Machine do porowatości pęknięć
Digital Radiography Unicomp UNC160 X ray machine for Electric insulator Non-destructive testing of crack porosity System Parameters Dimensions 2100mm*1549mm*2468mm(L*W*H) Equipment weight 3.5T Power 6KW Maximum penetration(AL/FE) 100mm/20mm Detection range Φ500*800mm Load weight 50kg Work environment 5-40° ≤80%HR Install power Three-phase five-wire system AC380V X-ray leakage dose rate ≤1uSv/h X-ray Generator Tube voltage 160kV Power 480W Focal size 0.5mm Detector Image area
Real Time Digital X-Ray Machine AX7900 do kontroli wewnętrznych wad kondensatorów
Wire Harness Quality Detection AX7900 Electronics Unicomp X Ray Equipment Description of IC X-Ray machine AX7900: Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. APPLICATION of IC Xray machine AX7900: FEATURES of IC Xray machine AX7900: Technical Specifications of AX7900 Item Definition Specs System Summary Footprint 1200
Mikronowe urządzenia rentgenowskie NDT o wysokiej rozdzielczości Unicomp UNC160 do badań nieniszczących izolatorów
High Resolution Micron NDT X-Ray Machine UNC160 Advanced non-destructive testing system designed for comprehensive inspection of insulators and industrial components with micron-level precision. Applications Cast parts and Pressure Vessels Steel pipe, Cylinder, and Wood Epoxy Resin Defect Detection Wheel, Tires, and Metal parts Technical Specifications System Parameters Dimensions Equipment weight 3.2T Power 6KW Detection range Φ600*800mm Load weight 100kg Install power Three
Urządzenie rentgenowskie NDT o wysokiej rozdzielczości UNC160 do kontroli wewnętrznych wad spawania rur z tworzyw sztucznych
High Resolution NDT X-Ray machine UNC160 for plastic pipe inner welding defects inspection Features: ● Strong penetration,high reliable,low breakdown, long life; ● High definition,resolution FPD; ● Multi-functional workstation,360°rotation and shift; ● High automation,fast detection speed; ● User friendly software design for interfacing and to facilitate,customize software function development requirement. Applications: ● Cast parts and pressure Vessels ● Steel pipe,Cylinder
W pełni automatyczny ruch CNC z manipulatorem ramienia C Maszyna rentgenowska Unicomp UNC160 do testowania obudowy do odlewania baterii litowych
Full automatic CNC motion with C arm manipulator Unicomp X-ray machine UNC160 for lithium battery casting housing testing Features: ● Strong penetration,high reliable,low breakdown, long life; ● High definition,resolution FPD; ● Multi-functional workstation,360°rotation and shift; ● High automation,fast detection speed; ● User friendly software design for interfacing and to facilitate,customize software function development requirement. Applications: ● Cast parts and pressure
Aparat rentgenowski Unicomp UMC160 NDT z obsługą robota do baterii litowej odlew aluminiowy obudowa wady spoin det
Unicomp UMC160 NDT X-ray machine with robot handling for lithium battery aluminum casting housing weld defects flaws detection Features: ● Strong penetration,high reliable,low breakdown, long life; ● High definition,resolution FPD; ● Multi-functional workstation,360°rotation and shift; ● High automation,fast detection speed; ● User friendly software design for interfacing and to facilitate,customize software function development requirement. Applications: ● Cast parts and
Spawarka półprzewodnikowa o wysokiej rozdzielczości 90KV 5um
90kV 5um High Resolution And Long Lifespan X-Ray Machine For SMD PCBA Soldering Qualtiy Inspection The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and
Maszyna rentgenowska PCB o wysokim powiększeniu Unicomp AX9100MAX do kontroli drutu wiązania komponentów elektronicznych IC
High Magnifications PCB X-Ray Machine Unicomp AX9100MAX Advanced X-ray inspection system for electronics IC components and bonding wire analysis with high precision non-destructive testing capabilities. This system is widely deployed for high-precision non-destructive inspection across extensive industrial and semiconductor applications, covering BGA, CSP, flip chips, LED packaging components, fuses, power diodes, multi-layer PCBs, discrete semiconductors, and lithium battery
Półprzewodnikowa elektronika 110kV X Ray 5um AX8500 Do PCBA BGA
110kV 5um Microfocus X Ray Machine with high resolution FPD AX8500 For PCBA BGA void Inspection Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD)
