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real time x ray inspection equipment

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Jakość Radiografia Unicomp UNC160 X Ray Machine 160KV do kontroli NDT fabryka

Radiografia Unicomp UNC160 X Ray Machine 160KV do kontroli NDT

UNC160 Automotive Parts X-ray Inspection Equipment Aviation Automation Applications: ● Cast parts and pressure Vessels ● Epoxy Resin Defect Detection ● Wheel,Tires and Metal parts ● Steel pipe,Cylinder and Wood System Parameters Dimensions 2100mm*1549mm*2468mm(L*W*H) Equipment weight 3.5T Power 6KW Maximum penetration(AL/FE) 100mm/20mm Detection range Φ500*800mm Load weight 50kg Work environment 5-40° ≤80%HR Install power Three-phase five wire system AC380V X-ray leakage dose

Jakość Przemysłowy sprzęt rentgenowski NDT w czasie rzeczywistym do klocków hamulcowych Certyfikat CE / FCC fabryka

Przemysłowy sprzęt rentgenowski NDT w czasie rzeczywistym do klocków hamulcowych Certyfikat CE / FCC

CE/FCC Certificated Real Time Industrial NDT X Ray Equipment for Brake Pads Applications of NDT X-ray Machine UNC160: ● Cast parts and Pressure Vessels ● Steel pipe, Cylinder, and Wood ● Epoxy Resin Defect Detection ● Wheel, Tires, and Metal parts Technical Specifications of NDT X-ray Machine UNC160 System Parameters Dimensions 2100mm*1549mm*2468mm(L*W*H) Equipment weight 3.5T Power 6KW Maximum penetration(AL/FE) 100mm/20mm Detection range Φ500*800mm Load weight 50kg Work

Jakość W rzeczywistym czasie przemysłowe urządzenia NDT promieniowania rentgenowskiego do odlewów aluminium, posiadające certyfikat CE/FCC fabryka

W rzeczywistym czasie przemysłowe urządzenia NDT promieniowania rentgenowskiego do odlewów aluminium, posiadające certyfikat CE/FCC

Real Time NDT UNC160 X Ray Equipment For Automotive Parts Quality Checking Applications of NDT X-ray Machine UNC160: ● Cast parts and Pressure Vessels ● Steel pipe, Cylinder, and Wood ● Epoxy Resin Defect Detection ● Wheel, Tires, and Metal parts Technical Specifications of NDT X-ray Machine UNC160 System Parameters Dimensions 2100mm*1549mm*2468mm(L*W*H) Equipment weight 3.5T Power 6KW Maximum penetration(AL/FE) 100mm/20mm Detection range Φ500*800mm Load weight 50kg Work

Jakość Real Time Digital X-Ray Machine AX7900 do kontroli wewnętrznych wad kondensatorów fabryka

Real Time Digital X-Ray Machine AX7900 do kontroli wewnętrznych wad kondensatorów

Wire Harness Quality Detection AX7900 Electronics Unicomp X Ray Equipment Description of IC X-Ray machine AX7900: Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. APPLICATION of IC Xray machine AX7900: FEATURES of IC Xray machine AX7900: Technical Specifications of AX7900 Item Definition Specs System Summary Footprint 1200

Jakość Fabryczna dostawa Unicomp systemu kontroli rentgenowskiej 90KV microfocus 2.5D do kontroli defektów wewnętrznych wiórów fabryka

Fabryczna dostawa Unicomp systemu kontroli rentgenowskiej 90KV microfocus 2.5D do kontroli defektów wewnętrznych wiórów

Unicomp factory supply of 90KV microfocus 2.5D X-ray Inspection System for Chip Inner Defect Inspection Description: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading

Jakość Unicomp AX7900 90kV maszyna do kontroli rentgenowskiej do lutowania SMT BGA bez kontroli jakości IC fabryka

Unicomp AX7900 90kV maszyna do kontroli rentgenowskiej do lutowania SMT BGA bez kontroli jakości IC

Unicomp AX7900 90kV X ray inspection machine for SMT BGA soldering void IC quality inspection Description: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading area

Jakość Certyfikowany przez CE/FDA system kontroli rentgenowskiej FPD 90KV do wykrywania wad kondensatorów fabryka

Certyfikowany przez CE/FDA system kontroli rentgenowskiej FPD 90KV do wykrywania wad kondensatorów

Wire Harness Quality Detection AX7900 Electronics Unicomp X Ray Equipment Description of IC X-Ray machine AX7900: Widely applied for BGA, CSP, PCB, Flip Chip, LED, Fuse, Diode, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. APPLICATION of IC Xray machine AX7900: FEATURES of IC Xray machine AX7900: Technical Specifications of AX7900 Item Definition Specs System Summary Footprint 1200

Jakość X Ray Machine w czasie rzeczywistym, elektroniczny sprzęt kontrolny AX8500 fabryka

X Ray Machine w czasie rzeczywistym, elektroniczny sprzęt kontrolny AX8500

Electronic and electrical components PCB X Ray Machine AX8500​ The AX8500 X Ray Inspection System is a full featured high-performance x-ray inspection system with an unbeatable price to performance ratio and includes all of the advanced features you would expect to find on a much more expensive x-ray inspection system. Item Definition Specs Motion Control System Motion Control Mode Mouse&Joystick&Keyboard Max.Load Dimension 500x500mm Max.Detection Dimension 350x450mm Tilt

Jakość Maszyna rentgenowska 3um z zamkniętą rurą 1,6kW do SMT BGA CSP fabryka

Maszyna rentgenowska 3um z zamkniętą rurą 1,6kW do SMT BGA CSP

CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor,