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x ray detection equipment

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Jakość Odlewnia z odlewu żelaznego NDT X Ray Machine, sprzęt radiograficzny Ndt fabryka

Odlewnia z odlewu żelaznego NDT X Ray Machine, sprzęt radiograficzny Ndt

Foundry Ferrous Castings NDT X-ray Radioscope Equipment in Sri Lanka X-Ray shielded cabinet complies with the strictest international regulations for fully shielded radiation devices. The cabinet is completely self-contained. Manufactured in steel with complete lead shielding. Equipped with X-Ray sources from 160kV or Micro – focus sources up to 150kV . Equipped with Digital Flat Panel Detector (different sizes and resolution available). Cabinet designed with a double sliding

Jakość Obcy materiał Wykrywacz metalu X Ray maszyny do wad odlewniczych fabryka

Obcy materiał Wykrywacz metalu X Ray maszyny do wad odlewniczych

Casting Defects Foreign Material Metal X Ray Detection Machine in Uzbekistan Unicomp Technology automated x-ray systems inspect steel or aluminum alloy castings expressly for the automotive industry. The automated radioscopic inspection of aluminum die castings can be performed for an audit-based or production-level scale. Inspection System for Die Casting, Automotive Components, Defense Components, Cultural Assets and Large Products Appropriate for medium•large size

Jakość BGA X Ray Inspection System, X Ray Pcb Inspection Machine Wyższy zakres testowy fabryka

BGA X Ray Inspection System, X Ray Pcb Inspection Machine Wyższy zakres testowy

SMT , BGA , CSP , Flip Chip , LED BGA X Ray Inspection Machine Unicomp X-Ray Inspection System is a full featured high-performance x-ray inspection system with an unbeatable price to performance ratio and includes all of the advanced features you would expect to find on a much more expensive x-ray inspection system. Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage

Jakość Programowanie CNC detektor promieniowania rentgenowskiego automatyczny dla PCBA BGA CSP QFN fabryka

Programowanie CNC detektor promieniowania rentgenowskiego automatyczny dla PCBA BGA CSP QFN

Automatic Measurement With CNC Programming X-Ray Equipment For PCBA BGA CSP QFN Reflow Soldering Quality Inspection Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Test Images: Features: ● 1000X magnification, high-definition real-time image. ● 90-130KV 5μm X-Ray tube. ●

Jakość BGA QFN Unicomp X Ray Inspection System 130KV z ruchem 6 osi fabryka

BGA QFN Unicomp X Ray Inspection System 130KV z ruchem 6 osi

CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 1600 X Detection Region Max.Loading Size Φ570mm Max.Inspection Area 450mm x 450mm X-ray Leakage

Jakość 130kV Microfocus AX9100 Unicomp X Ray do złącza samochodowego fabryka

130kV Microfocus AX9100 Unicomp X Ray do złącza samochodowego

130kV Microfocus X-ray AX9100 for automotive connector inner connection quality defect wire broken inspection Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor,

Jakość Close Tube Unicomp X Ray AX9100 130kV do komponentów elektronicznych fabryka

Close Tube Unicomp X Ray AX9100 130kV do komponentów elektronicznych

130kV close tube X-ray Equipment AX9100 with high resolution FPD for electronics components couterfeit inspection Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification,

Jakość Unicomp AX9100 X Ray Machine SMT PCBA BGA LED QFN Lutowanie Void pomiaru fabryka

Unicomp AX9100 X Ray Machine SMT PCBA BGA LED QFN Lutowanie Void pomiaru

SMT PCBA BGA LED QFN Soldering void measurement by Unicomp AX9100 X Ray Machine Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ●

Jakość AX7900 Cyfrowa maszyna rentgenowska w czasie rzeczywistym do kontroli defektów wewnętrznych przełącznika fabryka

AX7900 Cyfrowa maszyna rentgenowska w czasie rzeczywistym do kontroli defektów wewnętrznych przełącznika

Real Time Digital X-Ray Machine AX7900 for Switch Inner Defects Inspection APPLICATION of IC Xray machine AX7900: LED, SMT, BGA, CSP, Flip Chip Inspection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die Casting, Moulding Plastic. Ceramics, Other Special Industries Technical Specifications of AX7900 Item Definition Specs System Parameters Size 1100(L)x1100(W)x1500(H)mm Weight 1000kg Power 220AC/50Hz