x ray detection equipment
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Spawalniczy test połączeń X Ray defektoskop z uziemieniem anodowym, pakiet drewnianych skrzynek
Welding Joint Test Machine X Ray Flaw Detector Unicomp Installed in Kenya Paneramic radiation NDT X Ray Equipment with ripple ceramic x-ray tube plays important parts in carrying on nondestructive examination for nonmetallic, light metal, casting, various alloys and pressure vessels etc, mainly detecting weld defects ,such as crack, blowhole, entrapped slag, incomplete fusion ,blowhole,bubble etc ,also using for shipbuilding ,airplane and national defense etc industry field
X Ray Chip Counter Minimalny rozmiar chipa 01005 z kamerą FPD Intensifier & Line scn
X Ray Chip Counter Minimum chip size 01005 with FPD Intensifier & Line scn camera Model CX6000 Max.Voltage 100kV Max.Current 3mA Spot Size 0.4mm Working Method Stand alone Imaging system Line scan camera Scanning accuracy >99.8% Scanning size 440 X 60 mm Minimum material size 01005 Display 22'LCD Display Dimensions 17000 X 900 X 970 mm Weight 1000 kg Safety
Desktop BGA Vids 90kV 8W Electronics X Ray Machine 22 "LCD
Technical Specifications Item Description Specifications X-Ray Tube Max. Voltages, Type 90kV, Closed Power Consumption 8W Focal Spot Size 5 μm Magnification 200X Detector Detector Type FPD Resolution 101 LP/cm Effective Area 58mm×54mm System Computer Operating System Industrial PC, Win 7, i7 Processor Monitor 22" LCD Software User Interface Unicomp Multi-function DXI image processing system Working Platform Max. Loading Area 235mm×205mm Max. Inspection Area 190mm×165mm Max.
Puste przestrzenie spawalnicze na stole warsztatowym 0,5 kW 90 kV Maszyna do kontroli rentgenowskiej 5 µm
Application SMT, BGA, CSP, Flip Chip, LED Detection, Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Aluminium Die-casting, Moulding Plastic, Ceramics, other special industries. Features 90kV 5µm closed X-ray tube High resolution FPD with 3-axis motion system, meet basic inspection demands Navigation in windows, target tracking conveniently Max. loading area 235mm×205mm mm, max. inspection area 165mm×190mm, with
Przenośna maszyna kontrolna X Ray 1uSv / h 90kV 0,5kW do PCBA
Technical Specifications Item Description Specifications X-Ray Tube Max. Voltages, Type 90kV, Closed Power Consumption 8W Focal Spot Size 5 μm Magnification 200X Detector Detector Type FPD Resolution 101 LP/cm Effective Area 58mm×54mm System Computer Operating System Industrial PC, Win 7, i7 Processor Monitor 22” LCD Software User Interface Unicomp Multi-function DXI image processing system Working Platform Max. Loading Area 235mm×205mm Max. Inspection Area 190mm×165mm Max.
1uSv / h 0,5kW Desktop X Ray Machine 5μm do płyt PCBA
Technical Specifications Item Description Specifications X-Ray Tube Max. Voltages, Type 90kV, Closed Power Consumption 8W Focal Spot Size 5μm Magnification 200X Detector Detector Type FPD Resolution 101 LP/cm Effective Area 58mm×54mm System Computer Operating System Industrial PC, Win 7, i7 Processor Monitor 22” LCD Software User Interface Unicomp Multi-function DXI image processing system Working Platform Max. Loading Area 235mm×205mm Max. Inspection Area 190mm×165mm Max.
Microfocus Closed Tube 90KV X Ray Inspection BGA Machine
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
BGA 90kV Electronics Maszyna rentgenowska do lutowania fotowoltaicznego
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
CSP AX8200 Electronics X Ray Machine 100KV do lutowania ogniw słonecznych
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
