x ray equipment
"
PCB SMT BGA LED Electronics X Ray Maszyna o dużej mocy X Ray Sources 100KV
PCB , SMT , BGA , LED Electronics X Ray Machine high power x-ray sources X-ray detection technology for the SMT production testing means brought new changes, it can be said that it is the desire to further improve the level of production technology to improve the quality of production, and will soon find the circuit assembly failure as a breakthrough. It's the best selection for the manufacturer. Applications: ● LED,SMT,BGA,CSP,Flip Chip Inspection. ● Semiconductor,Packaging
Elektronika Unicomp PCB X Ray Machine Szafka SMT do LED PCB, odlewów metalowych
Electronics SMT Cabinet Unicomp PCB X Ray Machine for PCB LED Installation Unicomp will provide installation and calibration service at the customers location Installation includes assistance in registering your new x-ray system with local and state agencies where applicable. One (1) on-site radiation survey at the time of installation with supporting documents. Training Training will include: Basic Radiation Safety. X-Ray system control functions. X-Ray image processing
Microfocus Closed Tube 90KV X Ray Inspection BGA Machine
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
BGA 90kV Electronics Maszyna rentgenowska do lutowania fotowoltaicznego
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
CSP AX8200 Electronics X Ray Machine 100KV do lutowania ogniw słonecznych
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
BGA QFN Unicomp X Ray Inspection System 130KV z ruchem 6 osi
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 1600 X Detection Region Max.Loading Size Φ570mm Max.Inspection Area 450mm x 450mm X-ray Leakage
130kV Microfocus AX9100 Unicomp X Ray do złącza samochodowego
130kV Microfocus X-ray AX9100 for automotive connector inner connection quality defect wire broken inspection Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor,
Unicomp AX9100 X Ray Machine SMT PCBA BGA LED QFN Lutowanie Void pomiaru
SMT PCBA BGA LED QFN Soldering void measurement by Unicomp AX9100 X Ray Machine Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ●
System kontroli rentgenowskiej w celu kontroli stanu opakowań małych paczek żywności
X-Ray Inspection System for Small Packed Food Packing Condition Inspection Product Description: Our state-of-the-art X-Ray foreign object detection equipment revolutionizes safety standards in the small packaged food, pharmaceutical, and health supplement sectors. By providing pinpoint accuracy in detecting even the smallest impurities, it guarantees purity and compliance with rigorous quality control measures. Ideal for manufacturers seeking to protect consumer health,
