x ray equipment
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Puste przestrzenie spawalnicze na stole warsztatowym 0,5 kW 90 kV Maszyna do kontroli rentgenowskiej 5 µm
Application SMT, BGA, CSP, Flip Chip, LED Detection, Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Aluminium Die-casting, Moulding Plastic, Ceramics, other special industries. Features 90kV 5µm closed X-ray tube High resolution FPD with 3-axis motion system, meet basic inspection demands Navigation in windows, target tracking conveniently Max. loading area 235mm×205mm mm, max. inspection area 165mm×190mm, with
1uSv / h 0,5kW Desktop X Ray Machine 5μm do płyt PCBA
Technical Specifications Item Description Specifications X-Ray Tube Max. Voltages, Type 90kV, Closed Power Consumption 8W Focal Spot Size 5μm Magnification 200X Detector Detector Type FPD Resolution 101 LP/cm Effective Area 58mm×54mm System Computer Operating System Industrial PC, Win 7, i7 Processor Monitor 22” LCD Software User Interface Unicomp Multi-function DXI image processing system Working Platform Max. Loading Area 235mm×205mm Max. Inspection Area 190mm×165mm Max.
Maszyna do wykrywania promieni rentgenowskich 5 µm 0,5 kW 1uSv / h do laboratorium
Application SMT, BGA, CSP, Flip Chip, LED Detection, Semiconductor, Packaging components, Battery Industry, Aluminium Die-casting, Moulding Plastic, Ceramics, other special industries. Electronic components, Automotive parts, Photo-voltaic, Features 90kV 5µm closed X-ray tube Max. loading area 235mm×205mm mm, max. inspection area 165mm×190mm, with 200X Magnification High resolution FPD with 3-axis motion system, meet basic inspection demands Navigation in windows, target
Elektroniczny sprzęt do kontroli rezystancji chipsetu SMT AX8200 X-Ray zamknięty 5g
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
Systemy kontroli rentgenowskiej wady porowatości 160KV do odlewów aluminiowych
Factory manufacturing 160kV X-ray RT system for Aluminum die casting void or porosity defect inspection Applications: ● Cast parts and pressure Vessels ● Steel pipe,Cylinder and Wood ● Epoxy Resin Defect Detection ● Wheel,Tires and Metal parts Inspection Images: Features: ● Strong penetration,high reliable,low breakdown, long life; ● High definition,resolution FPD; ● High automation,fast detection speed; ● User friendly software design for interfacing and to facilitate
Unicomp Offline NDT X Ray Inspection Machine do części odlewów motocyklowych
UNC160 Automotive Parts X-ray Inspection Equipment Aviation Automation Features: ● Strong penetration,high reliable,low breakdown, long life ● Multi-functional workstation,360°rotation and shift; ● High automation,fast detection speed; ● User friendly software design for interfacing and to facilitate,customize software function development requirement. ● High definition,resolution FPD; Applications: ● Cast parts and pressure Vessels ● Epoxy Resin Defect Detection ● Wheel
Analiza Inline SPC Electronics X Ray Machine LX2000 FPC do lutowania BGA QFN
Fully automatic Inspection and Analysing Inline AXI LX2000 X-ray for BGA , QFN soldering void inspection one FPC Technical Parameters and Specifications System Summary Footprint 2595(W)×1392(D)×1992(H)mm Machine Weight 1900 kg (X-Ray) / 700kg (Conveyor) Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 180(W)×170(D)×190(H)cm (X-Ray) 150(W)×105(D)×120(H)cm (Conveyor) Packing Weight 2000kg (X-Ray) / 800kg (Conveyor) Power Consumption 3.5 kW X-Ray Tube Tube Type Sealed Max.
Unicomp LX2000 CSP BGA X Ray Maszyna EMS Inline AXI Inspekcje ceramicznego otworu wentylacyjnego
Using Unicomp LX2000 inline AXI X-ray to inspect ceremic air hole and cracks with Auto Inspection and Analysing Technical Parameters and Specifications System Summary Footprint 2595(W)×1392(D)×1992(H)mm Machine Weight 1900 kg (X-Ray) / 700kg (Conveyor) Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 180(W)×170(D)×190(H)cm (X-Ray) 150(W)×105(D)×120(H)cm (Conveyor) Packing Weight 2000kg (X-Ray) / 800kg (Conveyor) Power Consumption 3.5 kW X-Ray Tube Tube Type Sealed Max.
PCBA 5um Tube Unicomp X Ray AX7900 0.8KW Do montażu PCB
Unicomp 5um close tube AX7900 X-ray for printed circuit board assembly PCBA process quality inspection of Void Description: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max.
