x ray inspection system
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Materiały obce Kamień / Szkło / Metalika Maszyny do kontroli promieniowania rentgenowskiego do pakowania żywności
X-Ray detection equipment for dry pack food inspection with auto rejector Applications of Food Xray UNX4015-N UNX4015-N is used to detect foreign matter contaminants in small bags for lightweights products. Such as candy, fresh meat, prawn, vegetable, poultry, chocolates, candy, pasta, instant noodles, bread, biscuits, dried fish, ham sausage, beef jerky, nuts, etc. Technical Specifications of Food Xray UNX4015-N Equipment Features Dimension 1500(W)X1300(D)X2050(H)mm Machine
NDT Real Time X Ray Inspection Equipment 60 mm penetracja Wysoka gęstość Rozdzielczość
High Density Resolution NDT Real Time X Ray Image System 60mm Penetration The excellent image quality of the UNC450 system is based on the interplay of the digital flat-panel detector array with our Unicomp software. The technology provides exceptional detail detection, even though varying material thicknesses, and assists in visually determining the depth of casting flaws. Applications: Aerospace Automotive Foundries Science & Research Weld inspection 1. CNC programmable
Inline Crop Non-Destructive Testing X Ray Inspection Systems Skuteczny czas rzeczywisty dla obcych materiałów
Inline Crop NDT X Ray System , Effective Foreign Materials Real-time Detector Product Feature Flexibility Tooling and Fixture Easy to Operate, User-friendly Software Design Customized to Provide Solutions After-sales Service of Entire Network Low Cost of Testing Service Inspection Image:
BGA X Ray Inspection Maszyna Smt X Ray Maszyna o wysokiej jakości
BGA X Ray Inspection Machine Smt X Ray Machine with high quality Unicomp X-Ray Inspection System is a full featured high-performance x-ray inspection system with an unbeatable price to performance ratio and includes all of the advanced features you would expect to find on a much more expensive x-ray inspection system. Item Definition Specs System Parameters Size 1100(L)x1100(W)x1500(H)mm Weight 1000kg Power 220AC/50Hz Power Consumption 0.8kW X-ray Tube Type Closed Max.Voltage
Maszyna do kontroli rentgenowskiej Unicomp microfocus 2.5D AX7900 z widokiem ukośnym do kontroli pęknięć wiązek przewodów i kabli
Unicomp microfocus 2.5D X-ray inspection machine AX7900 with oblique view for Wire harness & cables cracks inspection Description: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines
System rentgenowski Unicomp AX7900 do kontroli wad wewnętrznych komponentów elektronicznych
Unicomp X-Ray inspection machine AX7900 for BGA inspection of Electronic Components FEATURES of IC Xray machine AX7900: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, X-Y multi-axis movement. ±60° "Arc" motion(Option). Motion controls include X/Y table motion plus Z-axis tube and detector movement, ±60° tilt motion (option). Multi-function DXI image processing system. X/Y programming function for multiple image inspection routines Max. loading area 420mm x
Komponenty elektroniczne BGA X Ray Inspection Machine
Online inspection system for Checking LED Semiconductor Electronic Components The X-Ray Inspection System is a full featured high-performance x-ray inspection system with an unbeatable price to performance ratio and includes all of the advanced features you would expect to find on a much more expensive x-ray inspection system. X-ray Inspecting Features: (1) Coverage of process defects up to 97%. Inspectible defects include: Empty solder, Bridge, Solder shortage, voids,
Unicomp AX8300 BGA X Ray Inspection Machine z niskim czasem przygotowania do testu
BGA X Ray Inspection Machine with high quality X ray images Unicomp AX8300 X-ray detection technology for the SMT production testing means brought new changes, it can be said that it is the desire to further improve the level of production technology to improve the quality of production, and will soon find the circuit assembly failure as a breakthrough. It's the best selection for the manufacturer. Model AX8300 Max kV/type 110 kV(Option90 kV)/Sealed Max.Electron beam power
Micro Focus Unicomp X Ray Machine AX7900 Do inspekcji SMT BGA Semicon IC
High Magnification cost effective Micro Focus X-ray machine AX7900 for SMT BGA and Semicon IC inspection Specifications of Xray machine: System Summary Footprint 1200(W)×1200(D)×1500(H)mm Machine Weight 1130 kg Power Supply AC 110/220V, 50/60Hz Plywood Packing Size 1350(W)×1350(D)×1800(H)mm Packing Weight 1330 kg Power Consumption 1.3 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD)
