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x ray inspection system

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Jakość System odlewniczy Unicomp NDT X Ray do kontroli porowatości odlewów ciśnieniowych kierownicy fabryka

System odlewniczy Unicomp NDT X Ray do kontroli porowatości odlewów ciśnieniowych kierownicy

Steering Wheel Diecasting Porosity Quality check with Unicomp NDT X ray System Technical Data of UNC160s Attribute Respective Value Sample Dimensions Outer width: 250 [mm] max. Outer diameter: 550 [mm] max. Maximum Sample Weight 15 [kg] System Dimension 1480mm*1106mm*2038mm(L*W*H) X-ray Tube 160 [kV] Detector Active Area 250*550mm Pixel Pitch 139 [m] Maximum penetration(AL) 100mm/20mm Detector Resolution 3.1LP/mm Our goal is to solve inspection problems with tailored systems,

Jakość Wysoce precyzyjna maszyna UNICOMP X Ray CT AX9500 do dokładnej kontroli PCB / BGA fabryka

Wysoce precyzyjna maszyna UNICOMP X Ray CT AX9500 do dokładnej kontroli PCB / BGA

High-precision CT machine AX9500 UNICOMP X-Ray Computed Tomography System for Accurate PCB and BGA Inspection Fully upgraded new products, can perform CT detection on BGA, CSP, flip chips, LEDs and other semiconductors, can also be used for SMT welding analysis, 3D tomography CT scanning system (planar CT + cone beam CT) Applications Widely Used in semiconductor, SMT, photovoltaic, ceramic products and other special industries, can also be used to detect auto parts, aluminum

Jakość System kontroli 3D X Ray Offline CT Unicomp AX9500 do kontroli warstw PCB fabryka

System kontroli 3D X Ray Offline CT Unicomp AX9500 do kontroli warstw PCB

3D X-Ray computed temography offline CT Inspection system unicomp AX9500 for PCB layers inspection Fully upgraded new products, can perform CT detection on BGA, CSP, flip chips, LEDs and other semiconductors, can also be used for SMT welding analysis, 3D tomography CT scanning system (planar CT + cone beam CT) Applications Widely Used in semiconductor, SMT, photovoltaic, ceramic products and other special industries, can also be used to detect auto parts, aluminum die-casting

Jakość Systemy rentgenowskie NDT Unicomp UNC160-C-L Badanie rentgenowskie odlewów 160KV fabryka

Systemy rentgenowskie NDT Unicomp UNC160-C-L Badanie rentgenowskie odlewów 160KV

NDT Unicomp X-Ray Systems UNC160-C-L Die Castings Pipe Inspection Features: * The implementation of automatic location detection * Automatic identification of defect detection * The unqualified product identification marking * OK and NG are sorting and recognition * High contrast, high quality image detection * Extended-modular design, strong, automatic loading and unloading * Adopt the design of transmission mechanism of high speed positioning, multi axis motion detection

Jakość Wysokowydajna elektronika X Ray Machine, SMT PCB X Ray Machine z 22-calowym monitorem LCD fabryka

Wysokowydajna elektronika X Ray Machine, SMT PCB X Ray Machine z 22-calowym monitorem LCD

Electronics X Ray Machine SMT BGA X-ray Detection Equipment for PCB X-ray inspection system has been widely applied to Circuit Board Inspection,Semi-Conductor Inspection and Other Applications. (Offline X - Ray series) widely used in offline detection, defect analysis, used for PCBA, packaging, ceramics, plastics, LED, and so on. Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● 7

Jakość Analiza lutowania metodą lutowania SMT / EMS X Ray Machine, systemy kontroli przemysłowej fabryka

Analiza lutowania metodą lutowania SMT / EMS X Ray Machine, systemy kontroli przemysłowej

Metal X Ray Machine Solder reflow analysis for PCB / BGA / LED X-ray detection technology for the SMT production testing means brought new changes, it can be said that it is the desire to further improve the level of production technology to improve the quality of production, and will soon find the circuit assembly failure as a breakthrough. It's the best selection for the manufacturer. Item Definition Specs System Parameters Size 1080(L)x1180(W)x1730(H)mm Weight 1150kg Power

Jakość Prześwietlenie mikrofokusowe 130kV Unicomp AX9100 do kontroli lutowania SMT PCBA BGA fabryka

Prześwietlenie mikrofokusowe 130kV Unicomp AX9100 do kontroli lutowania SMT PCBA BGA

130kV microfocus X-ray of Unicomp AX9100 for SMT PCBA BGA soldering Inspection Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery

Jakość Maszyna rentgenowska 2.5D 110kv Unicomp AX8500 do kontroli jakości leadframe Semicon z automatycznym pomiarem fabryka

Maszyna rentgenowska 2.5D 110kv Unicomp AX8500 do kontroli jakości leadframe Semicon z automatycznym pomiarem

2.5D 110kv X ray machine Unicomp AX8500 for Semicon leadframe quality checking with auto measurment Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector

Jakość CSP LED 110kV X Ray Scanner 5um Do lutowania taśm LED PCBA fabryka

CSP LED 110kV X Ray Scanner 5um Do lutowania taśm LED PCBA

110kV 5um microfocus AX8500 X-ray for LED Strip PCBA soldering void quality control Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD) Pixel Size