Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis
Podstawowe właściwości
Miejsce pochodzenia:
Chiny
Nazwa marki:
UNICOMP
Certyfikacja:
CE, FDA
Numer modelu:
AX9100max
Nieruchomości handlowe
Minimalna ilość zamówienia:
1 zestaw
Cena:
can negotiate
Warunki płatności:
L/C, T/T
Możliwość zaopatrzenia:
100 kompletów/miesiąc
Podsumowanie produktu
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse ...
Szczegóły produktu
Podkreślić:
Unicomp AX9100max X-ray inspection system
,Flip-Chip BGA X-ray machine
,FCBGA packaging analysis equipment
Monitor:
27-calowy wyświetlacz HD
System OS:
Windows10 64-bitowy
Hard Disk:
1 TB
RAM:
16G
CPU Model:
i7
Opis produktu
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis
The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including:
- BGA/CSP/Flip Chip packaging
- LED & optoelectronic components
- Fuse & diode manufacturing
- PCB & semiconductor assembly
- Battery production
- Small metal castings
- Electronic connector modules & cables
- Photovoltaic (PV) cell inspection
Application Fields
Application fields of Unicomp AX9100max X-ray Machine
Functions and Features
Functions and features of Unicomp AX9100max X-ray Machine
Inspection Image
Sample inspection image from Unicomp AX9100max X-ray Machine
Technical Parameters and Specifications
Technical specifications of Unicomp AX9100max X-ray Machine
Dimensions and Appearance
Dimensions and appearance of Unicomp AX9100max X-ray Machine
Ogólna ocena
5 GWIAZDEK
100%
4 gwiazdki
0
3 gwiazdki
0
2 gwiazdki
0
1 gwiazdka
0
Wszystkie recenzje
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TIt's useful for our product.
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JGood!
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SStable product quality , reliable cooperation partner
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