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automatic x ray machine

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Jakość Płyty elektroniczne 2D i 2.5D X-ray Machine AX9100MAX z 360 stopniami obracającym się stołem dla BGA&PCB fabryka

Płyty elektroniczne 2D i 2.5D X-ray Machine AX9100MAX z 360 stopniami obracającym się stołem dla BGA&PCB

Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.

Jakość Maszyna rentgenowska PCB o wysokim powiększeniu Unicomp AX9100MAX do kontroli drutu wiązania komponentów elektronicznych IC fabryka

Maszyna rentgenowska PCB o wysokim powiększeniu Unicomp AX9100MAX do kontroli drutu wiązania komponentów elektronicznych IC

Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 4 kW X-Ray Tube Tube Type Type Sealed type

Jakość Mierzenie zakrzywienia IC Unicomp AX9100MAX Maszyna rentgenowska o wielkości pikseli 84μm i kącie nachylenia 60° fabryka

Mierzenie zakrzywienia IC Unicomp AX9100MAX Maszyna rentgenowska o wielkości pikseli 84μm i kącie nachylenia 60°

It is widely utilized in applications such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, Photovoltaic Industry, and more. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 4 kW X-Ray

Jakość SMT PCB X-Ray Machine Unicomp AX9100MAX Wysokiej rozdzielczości Mikron Focus Spot Size dla BGA Voids i Inspekcji Pasty Lutowej fabryka

SMT PCB X-Ray Machine Unicomp AX9100MAX Wysokiej rozdzielczości Mikron Focus Spot Size dla BGA Voids i Inspekcji Pasty Lutowej

It finds extensive use in various fields including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, and Photovoltaic Industry, among others. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption

Jakość 130KV Mikron Focus Spot Size Tube X-Ray Machine Unicomp AX9100 Zmodernizowany model AX9100MAX z podwójnymi komputerami do inspekcji PCB&BGA fabryka

130KV Mikron Focus Spot Size Tube X-Ray Machine Unicomp AX9100 Zmodernizowany model AX9100MAX z podwójnymi komputerami do inspekcji PCB&BGA

It is widely applied in numerous fields such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, and Photovoltaic Industry, to name a few. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 4

Jakość Wysokie specyfikacje płyty elektroniczne 2D i 2.5D X-Ray Machine Unicomp AX9100MAX z 360 stopniami obracającymi się stołem do inspekcji BGA i PCB fabryka

Wysokie specyfikacje płyty elektroniczne 2D i 2.5D X-Ray Machine Unicomp AX9100MAX z 360 stopniami obracającymi się stołem do inspekcji BGA i PCB

It enjoys broad utilization across diverse domains including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, Small-scale Metal Casting, Electronic Connector Modules, Cables, and the Photovoltaic Industry, among others. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight

Jakość Automatyczny system NDT X Ray, aluminiowa piasta kontrolująca maszynę fabryka

Automatyczny system NDT X Ray, aluminiowa piasta kontrolująca maszynę

Automatic Aluminium Wheels Hub Inspection NDT X Ray Equipment System The inspection systems are mostly integrated as inline-systems in a foundry. Most requirements of an inspection system are based on detection of defects and on the inline - integration in an industrial environment. 1. high availability (approx. > 95%) 2. high throughput (>80 wheels per hour) 3. detection of all relevant defects with a minimum of false rejects 4. minimum of maintenance effort 5. easy system

Jakość In-line Laminated Power Bateria litowa X Ray Machine LX-1D12-100 fabryka

In-line Laminated Power Bateria litowa X Ray Machine LX-1D12-100

In-line Laminated Power Lithium Battery X-ray Detector LX-1D12-100 Features: 1, micro-focus tube, the image is more clear; 2, automatic loading and unloading, more labor; 3, the magnification can be adjusted; 4, easy parameter setting, automatic judgment sorting bad product; 5, user-friendly software interface, easy to get started; 6, fully automated operations, reduce manpower, reduce production costs, improve production efficiency and quality consistency; 7, the software

Jakość In-line Cylindryczna bateria litowo-jonowa z bezpieczną konstrukcją fabryka

In-line Cylindryczna bateria litowo-jonowa z bezpieczną konstrukcją

In-line Cylindrical Lithium Battery X-ray Detector with Safety-oriented design The lithium battery X-Ray detection equipment of multiple types and full automation solely-developed by Unicomp Technology is targetted to inspect cells alignment metric and tabs soldering quality . It improves automation as well as gains high-definition internal images by means of X-ray imaging technology . This technology is widely applied to the detection of lithium battery in various types