bga inspection equipment
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Wysoka penetracja Inline 3D CT Machine Maszyna rentgenowska do testowania PCB Unicomp LX9200
High penetration inline 3D CT machine X-Ray machine for PCB testing Unicomp LX9200 with real-time display Unicomp Technology 3D Inline X-ray Inspection Equipment——LX9200 As a new generation of upgraded and optimized LX9200 online inspection equipment, it can easily meet the multi-directional and multi-angle product inspection needs of different users. Application Field SMT/PCBA Package type:BGA,LGA,CSP,POP,SIP... Defect type:Void,HIP,Insufficient,Bridge... Semiconductor
EMS SMT Electronics X Ray Machine 90kV FPD Detektor Unicomp
EMS SMT Electronics X Ray Machine 90kV FPD Detector Unicomp Original manufacturer SMT Equipment Electronics X Ray Machine on IC chips wire Analysis Specifications of Xray machine: System Summary Footprint 1200(W)×1200(D)×1500(H)mm Machine Weight 1130 kg Power Supply AC 110/220V, 50/60Hz Plywood Packing Size 1350(W)×1350(D)×1800(H)mm Packing Weight 1330 kg Power Consumption 1.3 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging
Kompaktowa, przenośna maszyna rentgenowska o niewielkich rozmiarach do półprzewodników elektrycznych
Unicomp CX3000 Small footprint compact portable Desktop X-ray Machine For Electrnoics Semiconductor Specification Of Desktop X-Ray machine Item Definition Specs System Parameters Size 750(L)x570(W)x890(H)mm Weight 300kg Power 220AC/50Hz Power Consumption 0.5kW X-ray Tube Type Closed Max.Voltage 100kV Max.Power 200μA Spot Size 5μm Detector Intensifier FPD X-ray Coverage 48mm x 54mm Resolution 208Lp/cm Work Station Max.Loading Size 200mm x 200mm Max.Inspection Area 200mm x
CX3000 Reel To Reel Electronics X Ray Machine 0,5kW do chipa CSP LED Flip
Brand New Generation of CX3000 with Reel to Reel Function Making It More Competitive Specification Of Desktop X-Ray machine Item Definition Specs System Parameters Size 750(L)x570(W)x890(H)mm Weight 300kg Power 220AC/50Hz Power Consumption 0.5kW X-ray Tube Type Closed Max.Voltage 100kV Max.Power 200μA Spot Size 5μm Detector Intensifier FPD X-ray Coverage 48mm x 54mm Resolution 208Lp/cm Work Station Max.Loading Size 200mm x 200mm Max.Inspection Area 200mm x 200mm Oblique Angle
1uSv / h 0,5kW Desktop X Ray Machine 5μm do płyt PCBA
Technical Specifications Item Description Specifications X-Ray Tube Max. Voltages, Type 90kV, Closed Power Consumption 8W Focal Spot Size 5μm Magnification 200X Detector Detector Type FPD Resolution 101 LP/cm Effective Area 58mm×54mm System Computer Operating System Industrial PC, Win 7, i7 Processor Monitor 22” LCD Software User Interface Unicomp Multi-function DXI image processing system Working Platform Max. Loading Area 235mm×205mm Max. Inspection Area 190mm×165mm Max.
Maszyna do wykrywania promieni rentgenowskich 5 µm 0,5 kW 1uSv / h do laboratorium
Application SMT, BGA, CSP, Flip Chip, LED Detection, Semiconductor, Packaging components, Battery Industry, Aluminium Die-casting, Moulding Plastic, Ceramics, other special industries. Electronic components, Automotive parts, Photo-voltaic, Features 90kV 5µm closed X-ray tube Max. loading area 235mm×205mm mm, max. inspection area 165mm×190mm, with 200X Magnification High resolution FPD with 3-axis motion system, meet basic inspection demands Navigation in windows, target
Close Tube Unicomp X Ray AX9100 130kV do komponentów elektronicznych
130kV close tube X-ray Equipment AX9100 with high resolution FPD for electronics components couterfeit inspection Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification,
Wysokoprecyzyjny montaż płytek drukowanych PTH z otworami przelotowymi X-ray AX7900 Unicomp Wysoka stabilność
X-Ray Inspection Equipment AX7900 UNICOMP AX7900 is a professional high-resolution micro-focus X-ray NDT testing machine for SMT production, semiconductor packaging and new energy battery quality inspection. Built with proprietary self-developed X-ray source and high-sensitivity digital imaging detector, it clearly visualizes invisible internal defects of electronic devices. It precisely detects BGA solder voids, interlayer separation of PCB boards, chip bonding defects,
X Ray Chip Counter Minimalny rozmiar chipa 01005 z kamerą FPD Intensifier & Line scn
X Ray Chip Counter Minimum chip size 01005 with FPD Intensifier & Line scn camera Model CX6000 Max.Voltage 100kV Max.Current 3mA Spot Size 0.4mm Working Method Stand alone Imaging system Line scan camera Scanning accuracy >99.8% Scanning size 440 X 60 mm Minimum material size 01005 Display 22'LCD Display Dimensions 17000 X 900 X 970 mm Weight 1000 kg Safety
