bga x ray inspection system
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System rentgenowski z mikrofokusem 90KV 5um z FPD o wysokiej rozdzielczości do sprawdzania pustek lutowniczych PCBA BGA
90KV 5um microfocus X-ray system with high resolution FPD for PCBA BGA soldering void checking Specifications of SMT Xray machine: System Summary Footprint 1200(W)×1200(D)×1500(H)mm Machine Weight 1130 kg Power Supply AC 110/220V, 50/60Hz Plywood Packing Size 1350(W)×1350(D)×1800(H)mm Packing Weight 1330 kg Power Consumption 1.3kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD) Pixel
Unicomp AX7900 Cyfrowa maszyna rentgenowska 90kV Tube FPD System obrazowania dla SMT EMS BGA
Unicomp AX7900 X-ray with 90kV Tube and FPD imaging system with automatic SMT BGA measurement per IPC 610 Specifications of Xray machine: System Summary Footprint 1200(W)×1200(D)×1500(H)mm Machine Weight 1130 kg Power Supply AC 110/220V, 50/60Hz Plywood Packing Size 1350(W)×1350(D)×1800(H)mm Packing Weight 1330 kg Power Consumption 1.3 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD)
Unicomp AX7900 Maszyny rentgenowskie z koncentracją mikronową do testowania przewodów wiązanych z komponentami układów stacjonarnych
Unicomp offline AX7900 X-ray machine with auto-mapping and BGA QFN LED soldering Void auto measurement Specifications of Unicomp offline AX7900 X-ray machine: System Summary Footprint 1200(W)×1200(D)×1500(H)mm Machine Weight 1130 kg Power Supply AC 110/220V, 50/60Hz Plywood Packing Size 1350(W)×1350(D)×1800(H)mm Packing Weight 1330 kg Power Consumption 1.3kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat
90kv Microfocus Close Tube SMT EMS X Ray Machine AX7900 Do SMT PCBA
90kv Microfocus Close Tube SMT EMS X Ray Machine AX7900 For SMT PCBA 90kv microfocus close tube AX7900 X-ray machine with FPD for SMT PCBA BGA soldering void inspection Description of AX7900: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing
5um Unicomp X Ray Machine XY Ruch wieloosiowy do kontroli pustki lutowniczej QFN
Cost effective high quality of Micro Focus X-ray machine AX7900 for SMT BGA QFN Soldering void check Description of AX7900: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max.
HD FPD Electronics X Ray Maszyna 1,3 kW do układów scalonych Semicon
HD FPD Electronics X Ray Machine 1.3kW For Semicon IC Chips Microfocus X Ray machine with HD FPD for semicon IC chips wire sweep broken defect Inspection Specifications of Xray machine: System Summary Footprint 1200(W)×1200(D)×1500(H)mm Machine Weight 1130 kg Power Supply AC 110/220V, 50/60Hz Plywood Packing Size 1350(W)×1350(D)×1800(H)mm Packing Weight 1330 kg Power Consumption 1.3kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm
Oryginalny producent urządzenia rentgenowskiego do kontroli układów scalonych i podrabianych komponentów
Original Manufacturer of X-ray machine for IC chips and component counterfeit inspection Specifications of Xray machine AX7900: System Summary Footprint 1200(W)×1200(D)×1500(H)mm Machine Weight 1130 kg Power Supply AC 110/220V, 50/60Hz Plywood Packing Size 1350(W)×1350(D)×1800(H)mm Packing Weight 1330 kg Power Consumption 1.3 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD) Pixel
System wykrywania promieniowania rentgenowskiego jakości lutownicy dla lampy LED pojazdów
EMS Semiconductor Unicomp X-Ray Inspection System Electronics BGA AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
Unicomp AX7900 SMT EMS X Ray Machine z mapowaniem CNC w standardzie IPC610
Unicomp AX7900 SMT EMS X Ray Machine With CNC Mapping IPC610 Standard Unicomp AX7900 X-ray with CNC Mapping and Auto QFN Void measurement Algorithm of IPC610 standard Specifications of Xray machine: System Summary Footprint 1200(W)×1200(D)×1500(H)mm Machine Weight 1130 kg Power Supply AC 110/220V, 50/60Hz Plywood Packing Size 1350(W)×1350(D)×1800(H)mm Packing Weight 1330 kg Power Consumption 1.3 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus
