bga x ray inspection system
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High Power PCB X Ray Maszyna X Ray Sources Unicomp AX8300 Dla LED
High power X ray sources PCB X Ray Machine Unicomp AX8300 for LED X-ray inspection system has been widely applied to Circuit Board Inspection,Semi-Conductor Inspection and Other Applications. (Offline X - Ray series) widely used in offline detection, defect analysis, used for PCBA, packaging, ceramics, plastics, LED, and so on. Major applications: PCBA BGA/IC LED Aliminum die casting Battery connector inspecting 1. Semiconductor package 2. Electronic connector module. 3.
Wysoka rozdzielczość PCB X Ray Maszyna z napięciem 100KV / 110KV Tube, 1700 kg Waga
High resolution PCB X Ray Machine with high quality X-ray images The AX-8300 is designed to address PCBA high resolution inspection requirements. The AX-8300 is the FIRST machine in the industry to utilize a special 110kV micro focus x-ray source! This is the Perfect “In Between” design that offers a solution when 90kV is not enough energy and 130kV is too much. Using a state of the art FPD (Flat Panel Display) detection, the AX-8300 can generate extreme high magnification
Wysoka rozdzielczość PCB X Ray Machine
Electronics PCB parts X ray Machine with a high-resolution imaging chain X-ray detection technology for the SMT production testing means brought new changes, it can be said that it is the desire to further improve the level of production technology to improve the quality of production, and will soon find the circuit assembly failure as a breakthrough. It's the best selection for the manufacturer. Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight
X Ray Semiconductor Inspection Equipment
Highly flexible semiconductor inspection system PCB X Ray Machine Description: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading area 420mm x 420mm , max. detection
IGBT BGA QFN X Ray Scanner Machine AX8200MAX z detektorem FPD
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 OUR SERVICE Your inquiry will be replied in 12 hours. Original Manufacture to customers, with competitive price. We provide one year warranty, free training and whole life technology support. We can arrange the shipment by air, DHL,Fedex, UPS, and by Sea,etc for you,and will give you the tracking NO. after shipment. Well-trained and Professional after-sales service team to support you. Manual will
AC 110 ~ 220V Bga Sprzęt inspekcyjny Hi Resolution Detektor FPD Do SMT Industrial
Application Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries. Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Semiconductor, Packaging components, Battery Industry, Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Multi-function DXI image processing system, CNC programmable detection X-ray tube & detector automatic lifting and descending, with convenient
90kV 5um Unicomp X Ray Scanner Machine do SMT PCBA BGA CSP
X-Ray Inspection Machine Electronics BGA Standard Multifunction Unicomp Technology has a dedicated pool of local and foreign senior professional R & D engineers with extensive experience in high level science and technology. The company is undertaking major national special project (namely “02” project and “863” project) and X-ray detecting equipment R&D in new fields of application. It also works closely with The Chinese academy of sciences, Tsinghua University etc. to
CSP Electronics X Ray Machine UNICOMP CX3000 do złącza kablowego
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 Applications BGA Inspection Inspection of over molded electrical connectors Encapsulated components Aluminum die castings Molded plastic components Ceramics Aerospace components Electrical / mechanical components Electronic components SMT assemblies Pharmaceuticals Automotive assemblies Agriculture Counterfeit inspection Cell phone battery inspection The AX-8200 machine is designed to provide high
Unicomp AX9100max Electronics X Ray Machine FOR Flip-Chip BGA (FCBGA)
Unicomp AX9100max Electronics X Ray Machine FOR Flip-Chip BGA (FCBGA) The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse & diode manufacturing PCB & semiconductor assembly Battery production Small metal castings Electronic connector modules & cables Photovoltaic (PV) cell inspection Application Fields Application
