electronic inspection equipment
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Urządzenie do promieniowania rentgenowskiego Unicomp AX7900 Do EMS SMT PCBA BGA QFN CSP
CE FDA compliance x ray machine Unicomp AX7900 for EMS SMT PCBA BGA QFN CSP soldering Void checking Description: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading
IC Semiconductor Unicomp X Ray High Powiększenie Microfocus AX9100 130KV
Directly factory supply of microfocus X Ray System AX9100 with high magnification for IC Semiconductor Inspection Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification,
Urządzenia Inline NDT X Ray 2.8LP / Mm Detect Systemy testowania / kontroli dla piasty koła
Inline X-Ray Testing & Inspection Equipment & Systems for wheel hub Unicomp Technologies is a global supplier of innovative solutions for x-ray inspection and non-destructive testing (NDT). The unicomp systems are based on leading-edge x-ray and vision technology and ensure the fulfilment of customers' quality requirements. Unicomp Technologies’ product portfolio encompasses real-time failure analysis, including standardised systems for manual and automatic x-ray inspection,
Wiązania okablowania BGA Viods Cyfrowe urządzenie rentgenowskie 1kW 90KV
Item Description Specifications X-Ray Tube Max. Voltages, Type 90kV, Closed Power Consumption 8W Focal Spot Size 5 μm Motion range (Up and Down) 150mm Magnification 600X Detector FPD Active Area: 130mm*130mm Resolution 58 LP/cm Camera 2 Mega Pixel CCD Motion range (Up and Down) 290mm System Computer Operating System Industrial PC, Win 7, i7 Processor Monitor 22” LCD Software User Interface Unicomp Multi-function DXI image processing system Working Platform Max. Loading Area
X-ray licznik chipów SMD CX7000L 1,1 kW z integracją bazy danych magazynu ERP MES
Unicomp CX7000L X-ray for SMD Chip Counter with ERP MES warehouse database integration Main Configuration 1. Bar-code Scanner 2. X-ray System 3. Label Printer 4. Finger Printer Recognition System Equipment Features Footprint (W*D*H) / Machine Weight 1000 mm*1370 mm*1962 mm / 1160 kg Package Plywood Case, 110 cm*145 cm*210 cm, Total 1450 kg Power Consumption 1.1kW Power Supply AC 110~220V (±10%) 50Hz Working Mode Off-line System Computer Operating System Industrial PC, Windows
Unicomp AX9100 X Ray Machine SMT PCBA BGA LED QFN Lutowanie Void pomiaru
SMT PCBA BGA LED QFN Soldering void measurement by Unicomp AX9100 X Ray Machine Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ●
Przemysłowa maszyna rentgenowska NDT 160KV do odlewów aluminiowych
160KV Industrial NDT X Ray Machine For Aluminum Casting Parts Unicomp industrial X-ray NDT inspection equipment for Aluminum casting parts qualtiy control with AI Algorithm Technical Data of UNC160s Attribute Respective Value Sample Dimensions Outer width: 250 [mm] max. Outer diameter: 550 [mm] max. Maximum Sample Weight 15 [kg] System Dimension 1480mm*1106mm*2038mm(L*W*H) X-ray Tube 160 [kV] Detector Active Area 250*550mm Pixel Pitch 139 [m] Maximum penetration(AL) 100mm
Systemy rentgenowskie NDT Unicomp UNC160-C-L Badanie rentgenowskie odlewów 160KV
NDT Unicomp X-Ray Systems UNC160-C-L Die Castings Pipe Inspection Features: * The implementation of automatic location detection * Automatic identification of defect detection * The unqualified product identification marking * OK and NG are sorting and recognition * High contrast, high quality image detection * Extended-modular design, strong, automatic loading and unloading * Adopt the design of transmission mechanism of high speed positioning, multi axis motion detection
Kamera HD Unicomp X Ray 130kV do kontroli płyt PCBA
Application SMT, BGA, CSP, Flip Chip, LED Detection Ceramics, other special industries. Semiconductor, Packaging components, Battery Industry, Aluminium Die-casting, Moulding Plastic. Electronic components, Automotive parts, Photo-voltaic, Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55° and rotation 360°operation together with 6 axis movement 130kV (Option 110KV) 7µm closed X-ray tube, high speed & Millions
