electronic inspection equipment
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Unicomp X Ray Food Shoes Inspection System Piekarnia Candy Chicken
Food Foreign Materials X Ray Inspection Machine System Unicomp Unicomp known as the leading supplier for customized and standard X-ray inspection systems. To ensure a premium quality, all products are developed and produced locally as turnkey solutions. This leads to cutting edge technology and an unmatched flexibility. Application: Food security: all kinds of meat, seafood, fruits and vegetables, additive, milk, chocolate and other foreigh matter inside the test. Foreigh
Ndt Non Destructive Testowanie X Ray Machine
Economical Simplistic Compact NDT X-ray Inspection Sytem Laboratories The UNC160S is Unicomp Technology UNC series’s most compact system. The generous scanning envelope can handle products up to 25 cm in size making it a great choice for laboratories, small electronics and R&D applications Our Innovations Team is dedicated to listening to our customers and developing new technologies to best serve their wants and needs. Each new innovation is designed to improve capabilities,
Maszyna rentgenowska NDT o wysokiej penetracji Unicomp UNC160S 160kv do klocków hamulcowych do samochodów
Unicomp UNC160S Real Time DR High penetration X-Ray machine for cars brake pads non-destructive testing of crack void porosity flaw Our goal is to solve inspection problems with tailored systems, while guaranteeing a premium post-sales service. More than 15 years of expertise in industrial (NDT) and electronics applications combined with experienced engineers result in solutions that set new industry standards. Discover the invisible! 1. All Unicomp x-ray systems have CE
Maszyna do kontroli rentgenowskiej Unicomp microfocus 2.5D AX7900 z widokiem ukośnym do kontroli pęknięć wiązek przewodów i kabli
Unicomp microfocus 2.5D X-ray inspection machine AX7900 with oblique view for Wire harness & cables cracks inspection Description: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines
Unicomp LX9200 3D CT X Ray Computed Temography Machine 130KV Inline do kontroli PCB BGA
Unicomp high quality 130KV inline Unicomp LX9200 3D CT X-Ray computed temography machine for PCB BGA inspection Unicomp Technology 3D Inline X-ray Inspection Equipment——LX9200 As a new generation of upgraded and optimized LX9200 online inspection equipment, it can easily meet the multi-directional and multi-angle product inspection needs of different users. Application Field SMT/PCBA Package type: BGA, LGA, CSP, POP, SIP... Defect type: Void, HIP, Insufficient, Bridge...
1kW 1uSv / H 90KV Skaner rentgenowski do oświetlenia LED
Application It's mainly used in light strip backlight detection, LED bubble detection, TV backlight LED strip detection; It can also be applied to BGA, CSP, Flip ceramic element, chip electronic inspection, products.Aerospace connector semiconductor, module components, package testing, photovoltaic industry, battery industry, etc. Features Sµm closed X-Ray tube, HD digital flat panel Max. loading area 1300 x 650mm, Max. inspection area 1300 x 700mm ;600x Magnification
Wysoka precyzja ruchu 90kV uszczelniona lampa MOSFET komponent półprzewodnikowy sprzęt rentgenowski AX7900 Unicomp kontrola jakości
Electronic Semiconductor X-Ray Inspection Equipment AX7900 UNICOMP AX7900 is an advanced micro-focus X-ray NDT system manufactured by UNICOMP Technology.It delivers ultra-clear internal defect imaging for semiconductor packaging, SMT assembly and electronic component quality inspection.Adopting independently manufactured X-ray tubes and professional image analysis software, it effectively inspects solder voids, welding defects, PCB internal layers, battery cells and precision
Elektroniczna maszyna do inspekcji rentgenowskiej AX7900 Unicomp 5µm Micro Focus Automatyczne wykrywanie pustek BGA Lutowanie Wysoka precyzja
Electronic Semiconductor X-Ray Inspection Equipment AX7900 The UNICOMP AX7900 is a high-precision micro-focus X-ray inspection instrument launched by UNICOMP Technology. It focuses on non-destructive testing in electronic manufacturing and semiconductor fields. Integrated with self-developed core components and intelligent control system, it supports diversified inspection scenarios such as BGA, CSP, Flip Chip, LED, PCB, batteries and small metal castings. With excellent
90kV 5um Unicomp X Ray Scanner Machine do SMT PCBA BGA CSP
X-Ray Inspection Machine Electronics BGA Standard Multifunction Unicomp Technology has a dedicated pool of local and foreign senior professional R & D engineers with extensive experience in high level science and technology. The company is undertaking major national special project (namely “02” project and “863” project) and X-ray detecting equipment R&D in new fields of application. It also works closely with The Chinese academy of sciences, Tsinghua University etc. to
