electronics x ray system
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Wiodący w Chinach producent radiografii NDT X-ray Machine do kontroli jakości pęknięć spawania rur
160kV Digital Radiography Industrial NDT X-Ray inspection machine UNC160S for foundry castings non-destructive testing Our goal is to solve inspection problems with tailored systems, while guaranteeing a premium post-sales service. More than 15 years of expertise in industrial (NDT) and electronics applications combined with experienced engineers result in solutions that set new industry standards. Discover the invisible! 1. All Unicomp x-ray systems have CE approval. 2.
Kamera HD Unicomp X Ray 130kV do kontroli płyt PCBA
Application SMT, BGA, CSP, Flip Chip, LED Detection Ceramics, other special industries. Semiconductor, Packaging components, Battery Industry, Aluminium Die-casting, Moulding Plastic. Electronic components, Automotive parts, Photo-voltaic, Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55° and rotation 360°operation together with 6 axis movement 130kV (Option 110KV) 7µm closed X-ray tube, high speed & Millions
Unicomp AX8200MAX 5um microfocus X-Ray maszyna do EMS Automotive PCBA BGA QFN CSP inspekcja wad lutowniczych
Unicomp AX8200MAX 5um microfocus X-Ray machine for EMS Automotive PCBA BGA QFN CSP soldering defects Inspection Specification Of Unicomp AX8200MAX System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)×155(D)×200(H)cm Packing Weight 1500 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector
Unicomp 130kV Microfocus X Ray Source do kontroli jakości ogniw litowych EV
Unicomp 130kV Microfocus X-ray Source for EV Lithium Battery Cell quality check Key Parameter Max. Tube Voltage: 130kV Max. Tube Power: 65W Min. Spot Size:
130kV Microfocus X Ray Source do kontroli ogniw litowych laminowanych EV
130kV Microfocus X-ray Source for EV laminated Lithium Battery Cell inspection Key Parameter Max. Tube Voltage: 130kV Max. Tube Power: 65W Min. Spot Size:
Źródło promieniowania rentgenowskiego CE 130 kV Microfocus do kontroli ogniw akumulatorów litowo-jonowych z dziurkaczem polimerowym
130kV Microfocus X-ray tube for polymer punch Li-ion Battery Cell inspection Key Parameter Max. Tube Voltage: 130kV Max. Tube Power: 65W Min. Spot Size:
Chińska fabryka źródło promieniowania rentgenowskiego do urządzenia do kontroli promieniowania rentgenowskiego IGBT
Chinese Factory X Ray Source for X Ray Inspection Machine to check IGBT Key Parameter: Max. Tube Power: 60W Max. Tube Voltage: 150kV Beam Angle: 110±3° Min. Spot Size: ≤7μm Applications: Integrated Circuit Package EV Battery SMT, PCBA ,Electronic Manufacturing IGBT Substrate / Module Specifications: Operating Tube Voltage Range 40-150 kV Operating Tube Current Range 0-400 μA Maximum Tube Power 60W Power Consumption ＜150W Input Voltage (DC) 48±0.5V Window Material/Thickness Be
IGBT Defects Control Microfocus Źródło promieniowania rentgenowskiego zainstalowane na maszynie wykrywającej promieniowanie rentgenowskie
Chinese Factory X Ray Source for X Ray Inspection Machine to check IGBT Key Parameter: Max. Tube Power: 60W Max. Tube Voltage: 150kV Beam Angle: 110±3° Min. Spot Size: ≤7μm Applications: Integrated Circuit Package EV Battery SMT, PCBA ,Electronic Manufacturing IGBT Substrate / Module Specifications: Operating Tube Voltage Range 40-150 kV Operating Tube Current Range 0-400 μA Maximum Tube Power 60W Power Consumption ＜150W Input Voltage (DC) 48±0.5V Window Material/Thickness Be
Źródło rentgenowskie 160kV OpenTube Unicomp
160kV OpenTube X-ray Source Unicomp UNOS-U160B is an open tube 160 kV Microfocus X-Ray Source utilizing hot cathode technology, digital control, and 100% domestic raw materials. This system offers significant advantages including small focal spot size, high magnification, stable X-Ray emission, higher output power, and strong penetration ability. It is ideally suited for imaging applications requiring high resolution and high penetration capabilities. Key Parameters Maximum
