electronics x ray system
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Aparat rentgenowski wysokiej rozdzielczości Unicomp 90kV AX8200MAX
Unicomp 90kv High Resolution X-ray Machine AX8200MAX for Medical Syringe Needle Inspection Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate Control, CNC Programming
PCBA Lutowanie BGA Maszyna do kontroli rentgenowskiej Wysoka prędkość z dużym stołem próbek
Application Semiconductor, Packaging components, Battery Industry, SMT, BGA, CSP, Flip Chip, LED Detection Aluminium Die-casting, Moulding Plastic. Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55° and rotation 360°operation together with 6 axis movement 130kV (Option 110KV) 7µm closed X-ray tube, high speed & Millions
System półprzewodnikowy SMT Bga X Ray do wykrywania defektów wewnętrznych
Application Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries. Semiconductor, Packaging components, Battery Industry, SMT, BGA, CSP, Flip Chip, LED Detection Electronic components, Automotive parts, Photo-voltaic, Features X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Multi-function DXI image processing system, CNC programmable detection 130kV (Option 110KV) 7µm closed X-ray tube, high speed &
5um wysokiej rozdzielczości 90KV Unicomp X Ray FPD Detector do wiązek przewodów
Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1.Large Size Inspection Table Laser Locator for Precise Location 2.24’’ FHD Interactive Touch LCD Display 3.Accurate Control, CNC Programming Automatic Positioning 4.FPD 60° Tilting Inspection 5.Fingerprint Access Management System 6
Unicomp AX8200Max X Ray Machine 6-osiowy manipulator do programowalnej kontroli CNC
Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1.Large Size Inspection Table Laser Locator for Precise Location 2.24’’ FHD Interactive Touch LCD Display 3.Accurate Control, CNC Programming Automatic Positioning 4.FPD 60° Tilting Inspection 5.Fingerprint Access Management System 6
Skaner rentgenowski 5um 90kV Unicomp AX8200MAX do pustych przestrzeni SMT BGA QFN
90kV 5um microfocus Xray machine Unicomp AX8200MAX for SMT BGA QFN voids measurement with automatic inspection Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate
Certyfikat CE/FDA Unicomp 110KV 5μm Źródło promieniowania rentgenowskiego do sprawdzania jakości IC
CE/FDA Certificated Unicomp 110KV 5μm X Ray Source to check IC Quality Key Parameter: Max. Tube Voltage: 110kV Max. Tube Power: 25W Beam Angle: 110±3° Min. Spot Size: ≤5μm Beam Angle: 110±3° Applications: SMT, PCBA ,Electronic Manufacturing Integrated Circuit Package IGBT Substrate / Module EV Battery Specifications: Operating Tube Voltage Range 40-110 kV Operating Tube Current Range 0-250 μA Maximum Tube Power 25W Input Voltage (DC) 25±0.5V Power Consumption ＜75W Window
100% krajowy surowiec Unicomp Microfocus źródło promieniowania rentgenowskiego do precyzyjnej kontroli
100% Domestic Raw Material Unicomp Microfocus X Ray Source Key Parameter: Max. Tube Power: 25W Max. Tube Voltage: 110kV Beam Angle: 110±3° Beam Angle: 110±3° Min. Spot Size: ≤5μm Applications: Integrated Circuit Package SMT, PCBA ,Electronic Manufacturing EV Battery IGBT Substrate / Module Specifications: Operating Tube Voltage Range 40-110 kV Operating Tube Current Range 0-250 μA Maximum Tube Power 25W Input Voltage (DC) 25±0.5V Power Consumption ＜75W Window Material
Układ rentgenowski AX9100max z algorytmami rekonstrukcji obrazu o nadwyższej rozdzielczości
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 3.5 kW X-Ray Tube Tube Type Type Sealed type Max.
