industrial inspection systems
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5 μm Rozmiar punktu ostrości Urządzenie do kontroli rentgenowskiej PCBA 1100 kg pojemności
X-Ray Inspection Equipment for PCBA Description of IC X Ray machine AX7900: It is widely employed across multiple industries, including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, Photovoltaic Industry, among others. FEATURES of IC Xray machine AX7900: Laser Pinpointing System on a Large Inspection Table for Precise Positioning Accurate Control, CNC
Unicomp UNC160 Urządzenia rentgenowskie do kontroli silników motocykli
Unicomp UNC160 X-Ray for Motorcycle Engine Inspection Product Description: Primarily utilized for non-destructive testing of various products such as metal castings, hardware items, plastic products, refractory materials, composite materials, ceramic bodies, and welded metal parts. Features: Widespread Applications: Large inspection size and loading weight capacity Safety Standard: High level protection with international standard, multiple safety set up Image Proccessing:
Unicomp UNCT2600 225KV Micro Focus CT X-Ray Machine do inspekcji lotniczej i kosmicznej
Unicomp UNCT2600 225KV Micro Focus CT High-Precision X-Ray Machine Aerospace Engine Turbine Blade Quality Inspection System Product Attributes Attribute Value Footprint 3550*1750*2400mm Machine weight 7000kg Power supply 380AC/50Hz Product Overview The UNCT2600 is a cutting-edge, compact industrial CT inspection system designed for high-precision quality inspection in aerospace and other demanding industries. This versatile system accommodates materials of diverse sizes while
Unicomp UNCT3200 320kV System CT przemysłowy do kontroli łopatek silnika
Unicomp UNCT3200 High-Resolution 450KV 3D CT/Computed Tomography System for Engine Blades Castings Porosity Analysis Key Specifications Attribute Value Maximum tube voltage 320kV Maximum detected weight 100kg Imaging area ≤430mm×430mm Product Overview The UNCT3200 industrial CT testing equipment features a vertical dual-column structural design with a high-precision, solid marble base. Equipped with a high-energy split X-ray tube and large-format flat-panel detector, this
Unicomp UNC160 NDT X-Ray Inspection Equipment for Automotive Components
Unicomp UNC160 NDT X-Ray Inspection Equipment for Automotive Components Product Description Unicomp UNC160 X-Ray for detecting internal defects in brake pads. Mainly used in all kinds of metal castings, hardware products, plastic products, refractory materials, review materials, ceramic body and metal parts welding and other products for non-destructive. Features Widespread Applications: Large inspection size and loading weight capacity Safety Standard: High level protection
Przechylana maszyna do lutowania BGA Elektronika Xray Inspection AX8300MAX Unicomp Auto Void Analysis
Tilt BGA Solder Joint Electronics X-ray Inspection Machine AX8300MAX Advanced X-ray inspection system with Unicomp Auto Void Analysis for comprehensive semiconductor and electronics testing. Applications This system is widely applicable to semiconductor packaging (BGA, CSP, LED, Flip Chip), automotive parts, new energy industry components, aluminum die castings, injection molded plastics, ceramic products and other special industrial components. Key Features Professional
Obrót o 360° CNC Automatyczny montaż PCB MOSFET System kontroli Xray AX8300MAX Unicomp Stabilna wydajność
Tilt BGA Solder Joint Electronics Xray Inspection Machine AX8300MAX Unicomp Auto Void Analysis Application This system is widely applicable to semiconductor packaging (BGA, CSP, LED, Flip Chip), automotive parts, new energy industry components, aluminum die castings, injection molded plastics, ceramic products and other special industrial components. Features 1. Professional semiconductor inspection configuration with 5μm ultra-high resolution 2. Extended detection scope,
Systemy detekcji defektów X Ray Online Kontrola jakości od 130 KV do 450KV
Quality Inspection X ray Online Flaw Detection System 130 KV to 450KV Unicomp Technology UNC series NDT X ray real time imaging detection equipment is the standardized one for industrial NDT. Unicomp has rich experience in the design of NDT X-ray and solution of detection technology to help customers to achieve non-destructive testing in manufacturing process, research, project development and testing services, and ensure product quality. The technology and equipment are
100kV PCBA X Ray Inspection System Elektronika Unicomp do BGA Void / Lutowanie
Unicomp Electronics High Resolution PCBA X-Ray Efficient Inspection for BGA Void, Soldering Quality Specifications: Item Description Specifications X-Ray Tube Max. Voltages, Type 90kV, Closed (100kV Optional) Power Consumption 8W Focal Spot Size 5 μm Motion range (Up and Down) 150mm Magnification 600X Detector Intensifier 4”/2” (FPD Optional) Resolution 77/110 LP/cm Camera 200 Mega Pixel CCD Motion range (Up and Down) 290mm System Operating System Industrial PC, Win 7, i7
