industrial inspection systems
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AX9100 Unicomp X Ray Machine 130kV Zamknięta rurka do kontroli próżni lutowniczej PCBA BGA QFN
130kV maintenance free close tube X-ray machine Unicomp AX9100 For PCBA BGA QFN soldering Void check Technical Data Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 1600 X Detection Region Max.Loading Size Φ570mm Max.Inspection Area 450mm x 450mm X-ray Leakage
Wysoce precyzyjna maszyna UNICOMP X Ray CT AX9500 do dokładnej kontroli PCB / BGA
High-precision CT machine AX9500 UNICOMP X-Ray Computed Tomography System for Accurate PCB and BGA Inspection Fully upgraded new products, can perform CT detection on BGA, CSP, flip chips, LEDs and other semiconductors, can also be used for SMT welding analysis, 3D tomography CT scanning system (planar CT + cone beam CT) Applications Widely Used in semiconductor, SMT, photovoltaic, ceramic products and other special industries, can also be used to detect auto parts, aluminum
Unicomp X-ray AX8300VS Wielowarunkowy 3D Mikrofokusowy System Inspekcji Analizacji Promieniowania X
Unicomp X-ray AX8300VS Multi-mode 3d Micro-focus X-ray Analyze Inspection System Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features 1. precise detection inspection of tiny defects 2. multi-mode 3d reconstruction 3. synchronized 7-axis manipulation with any angle 4. batch mode positing inspection 5. closed tube with maintenance-free x-ray source 6.
Komponenty samochodowe NDT rentgen UNICOMP UNS160
Auto Components NDT X-ray UNICOMP UNS160 Real Time NDT UNS160 X-Ray Equipment for Automotive Parts Quality Checking Advanced X-ray inspection system designed for comprehensive quality control of automotive components and industrial parts. Applications Cast parts and Pressure Vessels Steel pipe, Cylinder, and Wood Epoxy Resin Defect Detection Wheel, Tires, and Metal parts Frequently Asked Questions How about the package? Is it safe during delivery? All X-ray inspection
System obrazowania rentgenowskiego w czasie rzeczywistym do dynamicznej dokładnej kontroli odlewów
Dynamic Precise Casting Part Inspection Real Time X-ray Image System The UNC320 is the newest standard system. Whether you are inspecting small or large components, the UNC320 is the best option for customers needing a compact system with unique capabilities generally available on a larger X-ray or CT system. SYSTEM CAPABILITIES Advanced 2D X-ray inspection Overall Maximum System Resolution: ~5 microns 50cm diameter x 80cm tall nominal part envelope Comprehensive acquisition,
Wysoka automatyka Bga X Ray Maszyna do wykrywania i analizy suchego stawu
Dry joint detection and analysis BGA X-Ray Inspection Machine X-ray inspection system has been widely applied to Circuit Board Inspection,Semi-Conductor Inspection and Other Applications. ( Offline X - Ray series ) widely used in offline detection, defect analysis, used for PCBA, packaging, ceramics, plastics, LED, and so on. Item Definition Specs Motion Control System Motion Control Mode Mouse&Joystick&Keyboard Max.Load Dimension 500x500mm Max.Detection Dimension 350x450mm
Cyfrowy system kontroli rentgenowskiej NDT Unicomp w czasie rzeczywistym UNC160S do wykrywania wad wewnętrznych spawania rur
Unicomp real time digital NDT X-ray Inspection System UNC160S for Pipe Inner welding flaws detection Our goal is to solve inspection problems with tailored systems, while guaranteeing a premium post-sales service. More than 15 years of expertise in industrial (NDT) and electronics applications combined with experienced engineers result in solutions that set new industry standards. Discover the invisible! 1. All Unicomp x-ray systems have CE approval. 2. Unicomp x-ray systems
22-calowy monitor LCD SMT EMS Wady lutownicze Elektroniczny sprzęt kontrolny Wysoka rozdzielczość
Application SMT, BGA, CSP, Flip Chip, LED Detection, Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries. Features 130kV (Option 110KV) 7µm closed X-ray tube, high speed & Millions pixels high resolution FPD Tilt detection with 55° and rotation 360°operation together with 6 axis movement X-ray tube & detector automatic lifting and descending,
Kamera HD Unicomp X Ray 130kV do kontroli płyt PCBA
Application SMT, BGA, CSP, Flip Chip, LED Detection Ceramics, other special industries. Semiconductor, Packaging components, Battery Industry, Aluminium Die-casting, Moulding Plastic. Electronic components, Automotive parts, Photo-voltaic, Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55° and rotation 360°operation together with 6 axis movement 130kV (Option 110KV) 7µm closed X-ray tube, high speed & Millions
