metal detector x ray machine
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Unicomp UNX6030 Maszyna do rentgenu żywności i napojów opcjonalna z różnymi odbiornikami
Food X ray Inspection System for Checking Foreign Matters within Packaged Food APPLICATION UNX6030-N is used to detect foreign matter contaminants in small bags for lightweights products. Such as candy, fresh meat, prawn, vegetable, poultry, chocolates, candy, pasta, instant noodles, bread, biscuits, dried fish, ham sausage, beef jerky, nuts, etc. FEATURES Tool free for conveyor belt and protective curtains Provide High precision automatic foreign detection, It can effectivel
Przemysł spożywczy i napojów X-Ray Machine AI algorytm głębokiego uczenia się Automatycznie identyfikuje i usuwa obce obiekty
UNX 4015 X-ray system for Prawn candy vegetable poultry dumplings foreign matters detection APPLICATION UNX4015-N is used to detect foreign matter contaminants in small bags for lightweights products. Such as candy, fresh meat, prawn, vegetable, poultry, chocolates, candy, pasta, instant noodles, bread, biscuits, dried fish, ham sausage, beef jerky, nuts, etc. Features Provide High precision automatic foreign detection, It can effectively identify metal, ceramic, glass, bone,
Maszyna rentgenowska PCB o wysokim powiększeniu Unicomp AX9100MAX do kontroli drutu wiązania komponentów elektronicznych IC
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 3.5 kW X-Ray Tube Tube Type Type Sealed type Max.
Automatyczna kontrola programowana CNC Elektronika aparat rentgenowski AX9100MAX z kątem nachylenia 60° do pomiaru krzywizny IC
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.
Wielkość punktu ostrości mikronów maszyny rentgenowskiej SMT PCB do pomiaru pustek BGA i inspekcji wysokości wspinaczki lutowniczej
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.
130KV Mikron Focus Spot Size Tube X-ray Machine AX9100MAX z podwójnymi komputerami do inspekcji PCB&BGA
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.
Płyty elektroniczne 2D i 2.5D X-ray Machine AX9100MAX z 360 stopniami obracającym się stołem dla BGA&PCB
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.
AX9100max Elektronika X-Ray Machine z stałym punktem śledzenia podczas nachylenia FPD
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 3.5 kW X-Ray Tube Tube Type Type Sealed type Max.
System kontroli rentgenowskiej Unicomp zmniejsza ryzyko zanieczyszczenia obcej materii
Unicomp X-ray inspection system reduces risk of foreign matter contamination Unicomp X-ray inspection system scans for contaminants and checks for foreign bodies in dry bulk powders, baking and snack products, cereal and crackers. It detects and automatically rejects contaminants, including glass shards, metal fragments, mineral stone, and some plastic and rubber compounds. The system includes software that collects data that can be stored centrally and used with optional
