metal x ray machine
"
Unicomp UNX6030N Maszyna do badania żywności promieniowania rentgenowskiego o dużym obciążeniu dla proszku mleka sojowego w poziomie wodoodporności IP66
Unicomp UNX6030N heavy load X ray food inspection machine for soybean milk powder in IP66 waterproof level APPLICATION The UNX6030-N is employed for detecting contaminants in the form of foreign matter within small packages containing lightweight products, including candies, fresh meat, prawns, vegetables, poultry, chocolates, pastries, instant noodles, bread, biscuits, dried fish, ham sausage, beef jerky, nuts, and more. FEATURES Easy to Operate: one button start&stop,
Kontrola rentgenowska małych opakowań żywności w celu wykrywania ciał obcych z automatycznym odrzutnikiem
Small packing food x-ray inspection for foreign matter detection with auto-rejector APPLICATION UNX4015-N is used to detect foreign matter contaminants in small bags for lightweights products. Such as candy, fresh meat, prawn, vegetable, poultry, chocolates, candy, pasta, instant noodles, bread, biscuits, dried fish, ham sausage, beef jerky, nuts, etc. Features Provide High precision automatic foreign detection, It can effectively identify metal, ceramic, glass, bone, shell
System kontroli rentgenowskiej Unicomp dla opakowań zbiorczych może sprawdzić zanieczyszczenie obcymi substancjami spożywczymi
Unicomp X-ray insepction system for pack bulk can food foreign matter contamincation check APPLICATION UNX4015-N is used to detect foreign matter contaminants in small bags for lightweights products. Such as candy, fresh meat, prawn, vegetable, poultry, chocolates, candy, pasta, instant noodles, bread, biscuits, dried fish, ham sausage, beef jerky, nuts, etc. Features Provide High precision automatic foreign detection, It can effectively identify metal, ceramic, glass, bone,
Wada wewnętrzna kondensatora Elektronika System kontroli rentgenowskiej BGA Automatyczne pomiary
Capacitor Inner Defect Inspection with Electronics X-ray 100 KV Power AX8200MAX Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1.Large Size Inspection Table Laser Locator for Precise Location 2.24’’ FHD Interactive Touch LCD Display 3.Accurate Control, CNC Programming Automatic
FPD Uszczelniony kondensator 100KV Pcb Kontrola rentgenowska Programowalny CNC
FPD 100KV X Ray Inspection System For Capacitor Function & Features Large Size Inspection Table Laser Locator for Precise Location 24’’ FHD Interactive Touch LCD Display Accurate Control, CNC ProgrammingAutomatic Positioning FPD 60° Tilting Inspection Fingerprint Access Management System Real-time Monitoring of Radiation Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic
Wady wewnętrzne kondensatora Sprzęt do kontroli rentgenowskiej Micro Focus Electronic
Micro Focus Electronics X Ray System For Capacitor Internal Defects Control Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features Fingerprint Access Management System Real-time Monitoring of Radiation 24’’ FHD Interactive Touch LCD Display Large Size Inspection Table Laser Locator for
5um wysokiej rozdzielczości 90KV Unicomp X Ray FPD Detector do wiązek przewodów
Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1.Large Size Inspection Table Laser Locator for Precise Location 2.24’’ FHD Interactive Touch LCD Display 3.Accurate Control, CNC Programming Automatic Positioning 4.FPD 60° Tilting Inspection 5.Fingerprint Access Management System 6
Close Tube Unicomp X Ray AX8200 Max 5μM do elektroniki samochodowej
Using Unicomp AX8200Max close tube Microfocus X-ray to detect Automotive electronics inner quality defects Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate Control,
System rentgenowski Unicomp AX9100max do kontroli wad wewnętrznych komponentów elektronicznych
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 3.5 kW X-Ray Tube Tube Type Type Sealed type Max.
