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Jakość Multimanipulator 160KV Radiografia DR X-ray NDT Maszyna do małych odlewów aluminiowych Sprawdzanie porowatości pęknięć fabryka

Multimanipulator 160KV Radiografia DR X-ray NDT Maszyna do małych odlewów aluminiowych Sprawdzanie porowatości pęknięć

Multi-manipulator 160KV Radiography DR X-ray NDT Machine for small alumimum Casting Parts crack porosity checking Technical Data of UNC160s Attribute Respective Value Sample Dimensions Outer width: 250 [mm] max. Outer diameter: 550 [mm] max. Maximum Sample Weight 15 [kg] System Dimension 1480mm*1106mm*2038mm(L*W*H) X-ray Tube 160 [kV] Detector Active Area 250*550mm Pixel Pitch 139 [m] Maximum penetration(AL) 100mm/20mm Detector Resolution 3.1LP/mm Our goal is to solve

Jakość 300 kg Maszyna X Ray do kontroli wysokiej dokładności przy odlewaniu ciśnieniowym fabryka

300 kg Maszyna X Ray do kontroli wysokiej dokładności przy odlewaniu ciśnieniowym

High accuracy inspection Benchtop Electronics PCBA Unicomp X-ray Machine The X-Ray Inspection System is a full featured high-performance x-ray inspection system with an unbeatable price to performance ratio and includes all of the advanced features you would expect to find on a much more expensive x-ray inspection system. Item Definition Specs System Parameters Size 750(L)x570(W)x890(H)mm Weight 300kg Power 220AC/50Hz Power Consumption 0.5kW X-ray Tube Type Closed Max.Voltage

Jakość Unicomp AX8200MAX 5um microfocus X-Ray maszyna do EMS Automotive PCBA BGA QFN CSP inspekcja wad lutowniczych fabryka

Unicomp AX8200MAX 5um microfocus X-Ray maszyna do EMS Automotive PCBA BGA QFN CSP inspekcja wad lutowniczych

Unicomp AX8200MAX 5um microfocus X-Ray machine for EMS Automotive PCBA BGA QFN CSP soldering defects Inspection Specification Of Unicomp AX8200MAX System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)×155(D)×200(H)cm Packing Weight 1500 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector

Jakość CSP Electronics X Ray Machine UNICOMP CX3000 do złącza kablowego fabryka

CSP Electronics X Ray Machine UNICOMP CX3000 do złącza kablowego

SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 Applications BGA Inspection Inspection of over molded electrical connectors Encapsulated components Aluminum die castings Molded plastic components Ceramics Aerospace components Electrical / mechanical components Electronic components SMT assemblies Pharmaceuticals Automotive assemblies Agriculture Counterfeit inspection Cell phone battery inspection The AX-8200 machine is designed to provide high

Jakość Elektroniczna maszyna do inspekcji rentgenowskiej AX7900 Unicomp 5µm Micro Focus Automatyczne wykrywanie pustek BGA Lutowanie Wysoka precyzja fabryka

Elektroniczna maszyna do inspekcji rentgenowskiej AX7900 Unicomp 5µm Micro Focus Automatyczne wykrywanie pustek BGA Lutowanie Wysoka precyzja

Electronic Semiconductor X-Ray Inspection Equipment AX7900 The UNICOMP AX7900 is a high-precision micro-focus X-ray inspection instrument launched by UNICOMP Technology. It focuses on non-destructive testing in electronic manufacturing and semiconductor fields. Integrated with self-developed core components and intelligent control system, it supports diversified inspection scenarios such as BGA, CSP, Flip Chip, LED, PCB, batteries and small metal castings. With excellent

Jakość Komponenty kapsułkowane Odporność Elektronika Urządzenie rentgenowskie Rozmiar plamki 5 μm fabryka

Komponenty kapsułkowane Odporność Elektronika Urządzenie rentgenowskie Rozmiar plamki 5 μm

Factory Manufacturing X Ray Machine 5μM For Resistance Applications Electrical / mechanical components Electronic components SMT assemblies Pharmaceuticals Automotive assemblies Agriculture Counterfeit inspection Cell phone battery inspection BGA Inspection Inspection of over molded electrical connectors Encapsulated components Aluminum die castings Molded plastic components Ceramics Aerospace components EMS Semiconductor Electronics X Ray Machine System for BGA and CSP

Jakość Unicomp AX8200max FPD Detector Maszyna rentgenowska do EMS SMT PCBA QFP fabryka

Unicomp AX8200max FPD Detector Maszyna rentgenowska do EMS SMT PCBA QFP

CHINA Leading X-ray manufacturer Unicomp AX8200max machine for EMS SMT PCBA QFP IC SOT package reflow Soldering Void Inspection Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1.Large Size Inspection Table Laser Locator for Precise Location 2.24’’ FHD Interactive Touch LCD Display 3

Jakość Skaner bezpieczeństwa Unicomp X Ray 90KV AX8200 do kontroli wad dźwięku fabryka

Skaner bezpieczeństwa Unicomp X Ray 90KV AX8200 do kontroli wad dźwięku

SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200ApplicationsBGA InspectionInspection of over molded electrical connectors Encapsulated components Aluminum die castings Molded plastic components Ceramics Aerospace components Electrical / mechanical components Electronic components SMT assemblies Pharmaceuticals Automotive assemblies Agriculture Counterfeit inspection Cell phone battery inspection The AX-8200 machine is designed to provide high

Jakość 220VAC CNC programowalna elektronika X Ray Machine 5um 90kV AX8200 fabryka

220VAC CNC programowalna elektronika X Ray Machine 5um 90kV AX8200

SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 Applications BGA Inspection Inspection of over molded electrical connectors Encapsulated components Aluminum die castings Molded plastic components Ceramics Aerospace components Electrical / mechanical components Electronic components SMT assemblies Pharmaceuticals Automotive assemblies Agriculture Counterfeit inspection Cell phone battery inspection Item Definition Specs System Parameters Size 1080(L