pcb x ray inspection
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System EMS Semiconductor Electronics X Ray do kontroli BGA i CSP
EMS Semiconductor Electronics X Ray Machine System for BGA and CSP inspection The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
FDA 90KV Zamknięty sprzęt do wykrywania promieni rentgenowskich w przypadku defektów oporności
FDP 90KV X-Ray Machine For Resistance Defects DetectingApplicationsBGA InspectionInspection of over molded electrical connectors Encapsulated components Aluminum die castings Molded plastic components Ceramics Aerospace components Electrical / mechanical components Electronic components SMT assemblies Pharmaceuticals Automotive assemblies Agriculture Counterfeit inspection Cell phone battery inspection EMS Semiconductor Electronics X Ray Machine System for BGA and CSP
Microfocus Closed Tube 90KV X Ray Inspection BGA Machine
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
BGA 90kV Electronics Maszyna rentgenowska do lutowania fotowoltaicznego
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
CSP AX8200 Electronics X Ray Machine 100KV do lutowania ogniw słonecznych
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
Skaner bezpieczeństwa Unicomp X Ray 90KV AX8200 do kontroli wad dźwięku
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200ApplicationsBGA InspectionInspection of over molded electrical connectors Encapsulated components Aluminum die castings Molded plastic components Ceramics Aerospace components Electrical / mechanical components Electronic components SMT assemblies Pharmaceuticals Automotive assemblies Agriculture Counterfeit inspection Cell phone battery inspection The AX-8200 machine is designed to provide high
Fałszywe urządzenie kontrolne EMS BGA X Ray do elementów elektronicznych
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 Item Definition Specs System Parameters Size 1080(L)x1180(W)x1730(H)mm Weight 1150kg Power 220AC/50Hz Power Consumption 0.8kW X-ray Tube Type Closed Max.Voltage 90kV/100kV Max.Power 8W Spot Size 5μm X-ray System Intensifier 4"Image Intensifier Monitor 22"LCD System Magnification 600x Detection Region Max.Loading Size 510mm x 420mm Max.Inspection Area 435mm x 385mm X-ray Leakage < 1uSv/h OUR SERVICE
Wysoka precyzja ruchu 90kV uszczelniona lampa MOSFET komponent półprzewodnikowy sprzęt rentgenowski AX7900 Unicomp kontrola jakości
Electronic Semiconductor X-Ray Inspection Equipment AX7900 UNICOMP AX7900 is an advanced micro-focus X-ray NDT system manufactured by UNICOMP Technology.It delivers ultra-clear internal defect imaging for semiconductor packaging, SMT assembly and electronic component quality inspection.Adopting independently manufactured X-ray tubes and professional image analysis software, it effectively inspects solder voids, welding defects, PCB internal layers, battery cells and precision
Aparat rentgenowski AX9100 130kV z zamkniętą rurą do lutowania SMT PCBA BGA Kontrola pustek i pomiar szybkości lutowania PTH
AX9100 130kV closed tube X-Ray machine for SMT PCBA BGA soldering Void inspection and PTH soldering rate measurement Features of X-Ray machine AX9100: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications of X-Ray machine AX9100: ●
