real time x ray machine
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Chiny X-ray manfuacturer Unicomp microfocus 130kV X-ray AX9100 z 2.5D FPD ukośny widok dla PCBA IC BGA PTH
China X-ray machines manfuacturer Unicomp microfocus 130kV X-ray AX9100 with 2.5D FPD oblique view for PCBA IC BGA PTH Features of X-ray AX9100: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications of X-ray AX9100: ● SMT, BGA, CSP,
Pomiar szczeliny lutowniczej SMT BGA Urządzenie rentgenowskie Microfocus 130kV
130kV 7 μm Microfovus X-Ray Machine For SMT BGA Soldering Void Measurement Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Features: ● 1000X magnification, high-definition real-time image. ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● One
AX9100 130kV Microfocus Electronics X Ray z FPD Oblique View 360 Stół obrotowy
AX9100 130kV microfocus X-ray with FPD oblique view and 360°rotation table for electronic components check Features of Unicomp AX9100: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications of Unicomp AX9100: ● SMT, BGA, CSP, Flip
5um Close Tube AX9100 Unicomp X Ray Machine FPD Ukośny widok do kontroli IC Semicon
Unicomp 5μm close tube AX9100 X-ray machine with FPD oblique view for IC Semicon inspection Technical Data Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 1600 X Detection Region Max.Loading Size Φ570mm Max.Inspection Area 450mm x 450mm X-ray Leakage
AX9100 130kV Elektronika X Ray do kontroli przemiatania drutu półprzewodnikowego
High Resolution of 130kV AX9100 X-ray for Semiconductor wire bonding sweep inspection Technical Data Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 1600 X Detection Region Max.Loading Size Φ570mm Max.Inspection Area 450mm x 450mm X-ray Leakage
AX9100 Unicomp X Ray Machine 130kV Zamknięta rurka do kontroli próżni lutowniczej PCBA BGA QFN
130kV maintenance free close tube X-ray machine Unicomp AX9100 For PCBA BGA QFN soldering Void check Technical Data Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 1600 X Detection Region Max.Loading Size Φ570mm Max.Inspection Area 450mm x 450mm X-ray Leakage
Niski rozkład 225KV NDT X Ray Machine Automotive Kontrola statków powietrznych
Unicomp X ray NDT Machine Automotive Aircraft Vessel Inspection Systems UNC225π Features: ● High reliable and long life,low breakdown ● High definition and resolution FPD ● C-arm fixture design enabling five-axis motion detection(optional automatic lift and descend) ● Multi-functional workstation,360°rotation and shift ● User friendly software design for easy interfacing can facilitate,customized software ● High penetration,Voltage up to 225KV,Maximum penetration thickness up
Wysoka rozdzielczość PCB X Ray Machine
Electronics PCB parts X ray Machine with a high-resolution imaging chain X-ray detection technology for the SMT production testing means brought new changes, it can be said that it is the desire to further improve the level of production technology to improve the quality of production, and will soon find the circuit assembly failure as a breakthrough. It's the best selection for the manufacturer. Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight
Aparat rentgenowski Unicomp microfocus do kontroli jakości litowych ogniw guzikowych TWS
Unicomp microfocus X Ray Machine for TWS Lithium Button Cell Quality Check Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery
