x ray detection equipment
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Rolnictwo Przemysłowe systemy kontroli X Ray Zainstalowane instalacje warzywne
Agriculture Industrial X Ray Inspection Systems Vegetable Fruit Installed in China Whether in the automotive, electronics or aircraft industry or for ship and vessel construction, Unicomp Technology is offering industrial X-ray inspection systems for nondestructive material testing which can fit in any manufacturing process and guarantee highest quality and safety standards for industrial products. Full cycle support from products design to testing procedures and high-quality
Inline Wheel Casting NDT X Ray Machine Wewnętrzna zewnętrzna struktura Nonconformity Detection
Inline Wheel Hub X-ray Inspection inner outer structure nonconformity detection UNC160-Y2-D9 is our inline X-ray inspection system for alloy wheels. Using our new digital detector array it combines high-speed wheel inspection with outstanding image quality. Unicomp Technology UNC series offer dynamic lines of imaging systems and services for automotive components that detect defects. Safety-critical cast component manufacturers utilize x-ray inspection technology to verify
Urządzenia Inline NDT X Ray 2.8LP / Mm Detect Systemy testowania / kontroli dla piasty koła
Inline X-Ray Testing & Inspection Equipment & Systems for wheel hub Unicomp Technologies is a global supplier of innovative solutions for x-ray inspection and non-destructive testing (NDT). The unicomp systems are based on leading-edge x-ray and vision technology and ensure the fulfilment of customers' quality requirements. Unicomp Technologies’ product portfolio encompasses real-time failure analysis, including standardised systems for manual and automatic x-ray inspection,
System kontroli rentgenowskiej Unicomp dla opakowań zbiorczych może sprawdzić zanieczyszczenie obcymi substancjami spożywczymi
Unicomp X-ray insepction system for pack bulk can food foreign matter contamincation check APPLICATION UNX4015-N is used to detect foreign matter contaminants in small bags for lightweights products. Such as candy, fresh meat, prawn, vegetable, poultry, chocolates, candy, pasta, instant noodles, bread, biscuits, dried fish, ham sausage, beef jerky, nuts, etc. Features Provide High precision automatic foreign detection, It can effectively identify metal, ceramic, glass, bone,
22-calowy monitor LCD SMT EMS Wady lutownicze Elektroniczny sprzęt kontrolny Wysoka rozdzielczość
Application SMT, BGA, CSP, Flip Chip, LED Detection, Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries. Features 130kV (Option 110KV) 7µm closed X-ray tube, high speed & Millions pixels high resolution FPD Tilt detection with 55° and rotation 360°operation together with 6 axis movement X-ray tube & detector automatic lifting and descending,
Elektronika Micro Focus System X Ray Elektroniczna kontrola wad wewnętrznych SMT
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55° and rotation 360°operation together with 6 axis movement X-ray tube & detector automatic lifting and descending, with
Elektronika o dużym powiększeniu System rentgenowski do kontroli pustek BGA CSP / QFN / PoP
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection. Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Multi-function DXI image processing
Wielofunkcyjna elektronika Maszyna rentgenowska Wysoka prędkość w czasie rzeczywistym dla złotej kuli
Application Aluminium Die-casting, Moulding Plastic. Semiconductor, Packaging components, Battery Industry, Ceramics, other special industries. SMT, BGA, CSP, Flip Chip, LED Detection, Electronic components, Automotive parts, Photo-voltaic, Features X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Multi-function DXI image processing
Elektronika kontrolna BGA PCB Maszyna rentgenowska Piłka golfowa Kontrola jakości
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection, Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55° and rotation 360°operation together with 6 axis movement Multi-function DXI image processing system, CNC programmable
