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Stand Alone Phone Toy Battery Szafa kontrolna RTV AX8200B
Stand Alone Phone Toy Battery X-ray Inspection Machine Cabinet AX8200B Features: ● Off-line lithium battery detection equipment ● 100KV 5μm closed X-ray tube, Hi-resolution detector ● X-ray tube and detector can be programmed to move to Z Axis ● Automatic control of all the moving parts, Automatic programming ● Convenient target point positioning system ● Automation software judgments detection Applications: ●Lithium battery pole piece solder joint defect detection, ●Lithium
Automatyczny system kontroli promieniowania rentgenowskiego 40-120 kV do wykrywania igieł
Food Safety Automatic X-ray Inspection Systems for Unpackaged Products Model UNF6040 Max Voltage 40-120kV Max Current 0.2-7.5mA Inspection Speed (m/min) 10-50 Inspection Accuracy(mm) Stainless steel ball ø0.5,Stainless steel wire 0.2x1.5, Glass2.0,Plastic 1.5 Image system Linear detector array Belt Food grade belt, length can be customized Tunnel Size(mm) 600x400 Max.Loading Weight 10kg Monitor 19' Dimension(WxDxH,mm) 1600x790x1800 Weight 500kg Safety
Kamera HD Unicomp X Ray 130kV do kontroli płyt PCBA
Application SMT, BGA, CSP, Flip Chip, LED Detection Ceramics, other special industries. Semiconductor, Packaging components, Battery Industry, Aluminium Die-casting, Moulding Plastic. Electronic components, Automotive parts, Photo-voltaic, Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55° and rotation 360°operation together with 6 axis movement 130kV (Option 110KV) 7µm closed X-ray tube, high speed & Millions
0.8kW 5um FDA Electronics X Ray Maszyna do lutowania SMT BGA
X-Ray Inspection Machine Electronics BGA Standard Multifunction Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. Applications:BGA , CSP , LED , Flip Chip , Semiconductor,Battery Industry , Small Metal Casting,Electronic Connector Module,Aerospace Components , Photovoltaic Industry,Other Special Industries. System
NDT Casting NDT X Ray Maszyna kompaktowa konstrukcja, rozdzielczość detektora 2,8LP / Mm
NDT Industrial X Ray Inspection Systems Compact Design Manufacturer Unicomp UNC320 is a compact industrial X-ray inspection system designed for broad aerospace and foundry (automotive) applications. Flexible 2D inspection of casting defects and production flaws provide the confidence of a safe and reliable analysis. Features: Reliable inspection decisions based on outstanding image quality High-speed wheel inspection of the heaviest wheels with our new gripper manipulator
Unicomp Odzież / Odzież Żywność i napoje X Ray Inspection Systems 40-120kV
Unicomp clothes garments X-ray Inspection Systems in Food Processing Plants detecting foreign matter Unicomp Efficient X-ray inspection systems are available for systematic detection and elimination of foreign material. They help food makers safeguard consumer health, mitigate the risk for extensive recall campaigns, and make sure that the reputation of their brands and compliance with applicable regulations remain intact. X-ray inspection systems are used wherever defects
Elektronika Micro Focus System X Ray Elektroniczna kontrola wad wewnętrznych SMT
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55° and rotation 360°operation together with 6 axis movement X-ray tube & detector automatic lifting and descending, with
Elektronika o dużym powiększeniu System rentgenowski do kontroli pustek BGA CSP / QFN / PoP
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection. Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Multi-function DXI image processing
Elektronika programowalna do detekcji CNC Maszyna rentgenowska Piłka golfowa Wewnętrzna kontrola jakości
Application Ceramics, other special industries. Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection. Features 130kV (Option 110KV) 7µm closed X-ray tube, high speed & Millions pixels high resolution FPD Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification X-ray tube & detector automatic lifting and
