x ray generators
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Unicomp 5um 90KV X Ray z ukośnym widokiem FPD do kontroli zamiatania drutu Semicon IC
Unicomp 5um 90KV X Ray with FPD oblique view for Semicon IC wire bonding sweeping check Specifications of Xray machine: System Summary Footprint 1200(W)×1200(D)×1500(H)mm Machine Weight 1130 kg Power Supply AC 110/220V, 50/60Hz Plywood Packing Size 1350(W)×1350(D)×1800(H)mm Packing Weight 1330 kg Power Consumption 1.3 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD) Pixel Size 85μm
Urządzenie do promieniowania rentgenowskiego Unicomp AX7900 Do EMS SMT PCBA BGA QFN CSP
CE FDA compliance x ray machine Unicomp AX7900 for EMS SMT PCBA BGA QFN CSP soldering Void checking Description: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading
Wyraźne obrazowanie Wykrywanie pustych przestrzeni BGA PCBA BGA X-ray AX9600 Unicomp SMT System kontroli montażu PCB
Clear Imaging BGA Void Detection PCBA BGA X-ray AX9600 Unicomp SMT PCB Assembly Inspection System UNICOMP AX9600 adopts an in-house developed 160kV high-power open micro-focus X-ray tube with an ultra-fine 0.8μm focal spot. It supports magnification up to 2000× and offers superior X-ray penetration, enabling precise void content measurement for TVS diodes. Optimized for high-end semiconductor inspection, it caters to high-precision quality control of advanced IC packaging,
Wysokoprecyzyjny montaż płytek drukowanych PTH z otworami przelotowymi X-ray AX7900 Unicomp Wysoka stabilność
X-Ray Inspection Equipment AX7900 UNICOMP AX7900 is a professional high-resolution micro-focus X-ray NDT testing machine for SMT production, semiconductor packaging and new energy battery quality inspection. Built with proprietary self-developed X-ray source and high-sensitivity digital imaging detector, it clearly visualizes invisible internal defects of electronic devices. It precisely detects BGA solder voids, interlayer separation of PCB boards, chip bonding defects,
UNC160 3,0LP / mm 6kW Maszyna kontrolna do żywicy epoksydowej
UNC160 Automotive Parts X-ray Inspection Equipment Aviation Automation Features: ● Strong penetration,high reliable,low breakdown, long life; ● High definition,resolution FPD; ● Multi-functional workstation,360°rotation and shift; ● High automation,fast detection speed; ● User friendly software design for interfacing and to facilitate,customize software function development requirement. Applications: ● Cast parts and pressure Vessels ● Epoxy Resin Defect Detection ● Wheel
Maszyna CT 320KV Unicomp UNCT3200 do testowania 3D cylindrów, odlewów metalowych, części lotniczych
320KV CT machine Unicomp UNCT3200 for cylinder,metal castings, aerospace parts 3D non-destructive testing Product Description: The UNCT3200 industrial CT scanner boasts a towering, double-column architecture supported by a monolithic marble base, renowned for its impeccable precision. It features a potent, segmented X-ray tube paired with a vast flat panel detector, designed to cater to the diverse inspection requirements of clients. This versatile inspection system
UNICOMP CX7000L Nieniszczący licznik wiórów 80 KV do dokładnej inwentaryzacji elektroniki
Unicomp Self-developed Software with Anti-interference Counting Algorithm CX7000L Chip Counter Technical Data of CX7000L Equipment Features Footprint (W*D*H) / Machine Weight 870 mm*1410 mm*1960 mm / 740 kg Package Plywood Case, 1050 cm*1650 cm*2200 cm, Total 920 kg Power Consumption 700W Power Supply 220V ±10% 50Hz/60Hz 3A System Computer Operating System Industrial PC, Windows11 RAM CPU Model 16G/I5 8 generation Monitor 27” FHD LCD Display X- R ay Tube Max. Voltage 80 kV
