x ray imaging system
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Unicomp UNCT3200 System tomografii komputerowej 3D o wysokiej rozdzielczości 450 KV do analizy porowatości odlewów łopatek silników
Unicomp UNCT3200 High-Resolution 450KV 3D CT System for engine blades Castings porosity analysis NDT Quality Inspection For Precision Turbine Blade Porosity Analysis Product Specifications Attribute Value Maximum tube voltage 450kV Focal size (EN 12543) d=0.4mm/d=1.0mm Maximum detected weight 100kg Imaging area ≤430mm×430mm Product Overview The UNCT3200 industrial CT testing machine features a vertical twin-column design with a high-precision, solid marble base. Equipped with
Unicomp UNCT3200 Wysokiej rozdzielczości 450KV 3D CT/komputerowy system tomografii do analizy porowatości odlewów łopatek silników
Unicomp UNCT3200 High-Resolution 450KV 3D CT/Computed Tomography System for Engine Blades Castings Porosity Analysis Product Overview UNCT3200 is a self-shielded, multi-purpose industrial CT computed tomography system designed to accommodate workpieces of various sizes and materials. This system meets industrial CT application demands across diverse industries and is specially engineered for high-precision inspection of medium and large products, including metal castings, non
Aparat rentgenowski o wysokiej rozdzielczości AX8200MAX do kontroli wad wewnętrznych chipów Semicon
High Resolution X-Ray machine AX8200MAX for Semicon Chip inner defects inspection Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate Control, CNC Programming Automatic
Aparat rentgenowski China Unicomp 90KV z systemem inspekcji HD PFD do wykrywania wad chipsetów
China Unicomp 90KV X-ray with HD PFD Inspection System for Chipset Defects Detecting Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate Control, CNC Programming
Unicomp UNCT3200 320kV System CT przemysłowy do kontroli łopatek silnika
Unicomp UNCT3200 High-Resolution 450KV 3D CT/Computed Tomography System for Engine Blades Castings Porosity Analysis Key Specifications Attribute Value Maximum tube voltage 320kV Maximum detected weight 100kg Imaging area ≤430mm×430mm Product Overview The UNCT3200 industrial CT testing equipment features a vertical dual-column structural design with a high-precision, solid marble base. Equipped with a high-energy split X-ray tube and large-format flat-panel detector, this
Przechylana maszyna do lutowania BGA Elektronika Xray Inspection AX8300MAX Unicomp Auto Void Analysis
Tilt BGA Solder Joint Electronics X-ray Inspection Machine AX8300MAX Advanced X-ray inspection system with Unicomp Auto Void Analysis for comprehensive semiconductor and electronics testing. Applications This system is widely applicable to semiconductor packaging (BGA, CSP, LED, Flip Chip), automotive parts, new energy industry components, aluminum die castings, injection molded plastics, ceramic products and other special industrial components. Key Features Professional
Maszyna radiograficzna cyfrowa i maszyna rentgenowska Unicomp AX7900 do naprawy PCB oraz pomiaru i testowania lutowania kulkowego IC/BGA
Digital Radiography machine & x ray machine Unicomp AX7900 for pcb repair and IC/BGA ball soldering measurement&testing Description of IC X Ray machine AX7900: It is widely adopted across multiple industries, including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB manufacturing, Semiconductor production, Batteries, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, and Photovoltaics. FEATURES of IC Xray machine AX7900: Large Size Inspection Table
90kv Real-time High Precision X Ray Machine Unicomp AX7900 Do kontroli jakości PCBA
90kv real-time high precision X ray machine Unicomp AX7900 for PCBA quality control Description of IC X Ray machine AX7900: It is extensively used in various industries, encompassing BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor production, Batteries, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, as well as Photovoltaics. FEATURES of IC Xray machine AX7900: Laser Pinpoint for Precise Location on Large-Scale Inspection Tables
5 mikronów wysokiej rozdzielczości 90kv X-Ray Machine Unicomp AX7900 z pięcioma mikronami rurki do testowania PCBA
5 micron high resolution 90kv X ray machine Unicomp AX7900 with five micron tube for PCBA testing Description of IC X Ray machine AX7900: Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. FEATURES of IC Xray machine AX7900: Large Size Inspection Table Laser Pinpoint For Precise Location Accurate Control, CNC Programming
