logo
Witamy na Unicomp Technology
+86-13502802495
ZNALEZIONY 911 produkty dla "

x ray imaging system

"
Jakość Przemysł samochodowy Spawanie kabli hamulcowych Sprzęt rentgenowski UNC160 Wysoka rozdzielczość fabryka

Przemysł samochodowy Spawanie kabli hamulcowych Sprzęt rentgenowski UNC160 Wysoka rozdzielczość

UNC160 High-Resolution X-Ray Equipment For Brake Cable Welding Quality Inspection In Automotive Industry Equipment: UNC160 Sample: Brake Cable Application: Auto parts, used in the automotive industry Testing: Specification: System Parameters Dimensions 2100mm*1549mm*2468mm(L*W*H) Equipment weight 3.5T Power 6KW Maximum penetration(AL/FE) 100mm/20mm Detection range Φ500*800mm Load weight 50kg Work environment 5-40° ≤80%HR Install power Three-phase five wire system AC380V X-ray

Jakość Analiza Inline SPC Electronics X Ray Machine LX2000 FPC do lutowania BGA QFN fabryka

Analiza Inline SPC Electronics X Ray Machine LX2000 FPC do lutowania BGA QFN

Fully automatic Inspection and Analysing Inline AXI LX2000 X-ray for BGA , QFN soldering void inspection one FPC Technical Parameters and Specifications System Summary Footprint 2595(W)×1392(D)×1992(H)mm Machine Weight 1900 kg (X-Ray) / 700kg (Conveyor) Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 180(W)×170(D)×190(H)cm (X-Ray) 150(W)×105(D)×120(H)cm (Conveyor) Packing Weight 2000kg (X-Ray) / 800kg (Conveyor) Power Consumption 3.5 kW X-Ray Tube Tube Type Sealed Max.

Jakość BGA QFN CSP X Ray Equipment LX2000 Programowalny CNC do lutowania FPC SMT fabryka

BGA QFN CSP X Ray Equipment LX2000 Programowalny CNC do lutowania FPC SMT

LX2000 inline x-ray equipment with CNC programmable inspection for FPC SMT soldering process of BGA , QFN, CSP parts Technical Parameters and Specifications System Summary Footprint 2595(W)×1392(D)×1992(H)mm Machine Weight 1900 kg (X-Ray) / 700kg (Conveyor) Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 180(W)×170(D)×190(H)cm (X-Ray) 150(W)×105(D)×120(H)cm (Conveyor) Packing Weight 2000kg (X-Ray) / 800kg (Conveyor) Power Consumption 3.5 kW X-Ray Tube Tube Type Sealed

Jakość CSP 130kV X Ray Security Scanner Automatyczna kontrola ceramicznych badań NDT fabryka

CSP 130kV X Ray Security Scanner Automatyczna kontrola ceramicznych badań NDT

130kV clsoed tube X-ray system with convenient mapping process for ceramic NDT quality testing Technical Parameters and Specifications System Summary Footprint 2595(W)×1392(D)×1992(H)mm Machine Weight 1900 kg (X-Ray) / 700kg (Conveyor) Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 180(W)×170(D)×190(H)cm (X-Ray) 150(W)×105(D)×120(H)cm (Conveyor) Packing Weight 2000kg (X-Ray) / 800kg (Conveyor) Power Consumption 3.5 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage

Jakość Unicomp LX2000 CSP BGA X Ray Maszyna EMS Inline AXI Inspekcje ceramicznego otworu wentylacyjnego fabryka

Unicomp LX2000 CSP BGA X Ray Maszyna EMS Inline AXI Inspekcje ceramicznego otworu wentylacyjnego

Using Unicomp LX2000 inline AXI X-ray to inspect ceremic air hole and cracks with Auto Inspection and Analysing Technical Parameters and Specifications System Summary Footprint 2595(W)×1392(D)×1992(H)mm Machine Weight 1900 kg (X-Ray) / 700kg (Conveyor) Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 180(W)×170(D)×190(H)cm (X-Ray) 150(W)×105(D)×120(H)cm (Conveyor) Packing Weight 2000kg (X-Ray) / 800kg (Conveyor) Power Consumption 3.5 kW X-Ray Tube Tube Type Sealed Max.

Jakość W pełni automatyczna elektroniczna maszyna rentgenowska LX2000 z mapowaniem CNC fabryka

W pełni automatyczna elektroniczna maszyna rentgenowska LX2000 z mapowaniem CNC

Fully Automatic Inline Electronics X Ray Machine LX2000 With CNC Mapping Unicomp Technology fully automatic Inline LX2000 AXI X-ray Inspection System with CNC mapping for IGBT Quality Control Technical Parameters and Specifications System Summary Footprint 2595(W)×1392(D)×1992(H)mm Machine Weight 1900 kg (X-Ray) / 700kg (Conveyor) Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 180(W)×170(D)×190(H)cm (X-Ray) 150(W)×105(D)×120(H)cm (Conveyor) Packing Weight 2000kg (X

Jakość Unicomp Inline Electronics X Ray Machine 3,5 kW do lutowania IGBT Semicon fabryka

Unicomp Inline Electronics X Ray Machine 3,5 kW do lutowania IGBT Semicon

Unicomp Inline Electronics X Ray Machine 3.5kW For IGBT Semicon Soldering Unicomp High Speed Inline 2D X-ray Inspection machine with cutting edge AI Algorithm For IGBT Semicon soldering void checking Technical Parameters and Specifications System Summary Footprint 2595(W)×1392(D)×1992(H)mm Machine Weight 1900 kg (X-Ray) / 700kg (Conveyor) Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 180(W)×170(D)×190(H)cm (X-Ray) 150(W)×105(D)×120(H)cm (Conveyor) Packing Weight

Jakość Maszyna rentgenowska w czasie rzeczywistym z rury rentgenowskiej o ostrości 5 mikronów do sprawdzania kul lutowych BGA fabryka

Maszyna rentgenowska w czasie rzeczywistym z rury rentgenowskiej o ostrości 5 mikronów do sprawdzania kul lutowych BGA

X-Ray Inspection Machine Electronics BGA Standard Multifunction Unicomp Technology has a dedicated pool of local and foreign senior professional R & D engineers with extensive experience in high level science and technology. The company is undertaking major national special project (namely “02” project and “863” project) and X-ray detecting equipment R&D in new fields of application. It also works closely with The Chinese academy of sciences, Tsinghua University etc. to

Jakość Źródło rentgenowskie 160kV OpenTube Unicomp fabryka

Źródło rentgenowskie 160kV OpenTube Unicomp

160kV OpenTube X-ray Source Unicomp UNOS-U160B is an open tube 160 kV Microfocus X-Ray Source utilizing hot cathode technology, digital control, and 100% domestic raw materials. This system offers significant advantages including small focal spot size, high magnification, stable X-Ray emission, higher output power, and strong penetration ability. It is ideally suited for imaging applications requiring high resolution and high penetration capabilities. Key Parameters Maximum