x ray imaging system
"
Sprzęt do elektronicznego wykrywania promieniowania wysokiej mocy Elektronika SMT BGA Semiconductor
High Power X-ray Detection Equipment Electronics SMT BGA Semiconductor Today, Unicomp Technology has three R&D /Manufacturing sites exceeding 25,000m2 respectively located at Wuxi/Jiangsu Province, Shenzhen/Guangdong Province, and Chongqing. Our sales and service centers are located all across China including Beijing, Shenyang, Tianjin, Xi'an, Qingdao, Wuhan, Chengdu, Ningbo , Xiamen and etc. The company has also penetrated into the international market with sales and service
Metalowe spawanie Przemysłowe urządzenie rentgenowskie Kompaktowa, wydajna i dokładna inspekcja
Compact Efficient Metal Welding Industrial X-ray High Accuracy Inspection The UNC225 is quite possibly the most conveniently sized system on the market. The system offers all of the same creature features as the larger systems while still maintaining the ability to fit through a standard interior door. The UNC225 is well suited for small to medium sized objects. Our Innovations Team is dedicated to listening to our customers and developing new technologies to best serve their
Testowanie odlewów Rozdzieranie SMT EMS X Ray Maszyna 225KV Ndt Testing Machine
Castings Testing Tearing Metal X Ray Machine Quality Inspection in Turkey Features: X-Ray shielded cabinet complies with the strictest international regulations for fully shielded radiation devices. The cabinet is completely self-contained. Manufactured in steel with complete lead shielding. Equipped with X-Ray sources from 160kV or Micro – focus sources up to 150kV . Equipped with Digital Flat Panel Detector (different sizes and resolution available). Cabinet designed with a
Wysoka automatyka Bga X Ray Maszyna do wykrywania i analizy suchego stawu
Dry joint detection and analysis BGA X-Ray Inspection Machine X-ray inspection system has been widely applied to Circuit Board Inspection,Semi-Conductor Inspection and Other Applications. ( Offline X - Ray series ) widely used in offline detection, defect analysis, used for PCBA, packaging, ceramics, plastics, LED, and so on. Item Definition Specs Motion Control System Motion Control Mode Mouse&Joystick&Keyboard Max.Load Dimension 500x500mm Max.Detection Dimension 350x450mm
Elektroniczna maszyna rentgenowska SMD do kabli, detektor promieniowania X Ray Unicomp AX8300 1500kg
SMD Cable Electronics Components Unicomp X-ray Detector AX8300 Model AX8300 Max kV/type 110 kV(Option90 kV)/Sealed Max.Electron beam power 25W(Option8W) Focal spot size1 7μm System magnification Up to 1000X Imaging system(Option) Flat Panel Detector Manipulator 8-axis with tilt 50 degree Measuring volume Max load area 300x300mm2 Max.sample weight 5kg Monitors 22" LCD Cabinet dimensions 1100x1100x1650mm Weight 1700kg Radiation safety2
Maszyna rentgenowska NDT
Quality NDT X ray machine Unicomp UNC225 with ASTM standard EN12543 for shock absorber defect testing Features: X-Ray shielded cabinet complies with the strictest international regulations for fully shielded radiation devices. The cabinet is completely self-contained. Manufactured in steel with complete lead shielding. Equipped with X-Ray sources from 160kV or Micro – focus sources up to 150kV . Equipped with Digital Flat Panel Detector (different sizes and resolution
Elektronika Micro Focus System X Ray Elektroniczna kontrola wad wewnętrznych SMT
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55° and rotation 360°operation together with 6 axis movement X-ray tube & detector automatic lifting and descending, with
Elektronika o dużym powiększeniu System rentgenowski do kontroli pustek BGA CSP / QFN / PoP
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection. Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Multi-function DXI image processing
Elektronika programowalna do detekcji CNC Maszyna rentgenowska Piłka golfowa Wewnętrzna kontrola jakości
Application Ceramics, other special industries. Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection. Features 130kV (Option 110KV) 7µm closed X-ray tube, high speed & Millions pixels high resolution FPD Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification X-ray tube & detector automatic lifting and
