x ray imaging system
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Maszyna do kontroli promieniowania rentgenowskiego 160KV Unicomp UNC160 do kontroli odlewów aluminium części samochodowych
160KV X-Ray Inspection Machine Unicomp UNC160 For Automotive Parts Aluminum Castings Inspection Product Description: Primarily utilized in a variety of products including metal castings, hardware items, plastic products, refractory materials, review materials, ceramic bodies, and metallic components for non-destructive welding and inspection purposes. Features: Extensive Applications: Capable of inspecting large sizes and heavy loads Safety Benchmark: Offers superior
Odlewanie maszyny rentgenowskiej Unicomp UNC160 Do odlewów aluminium Odlewanie metalu Badanie nieniszczące
Casting X-Ray Machine Unicomp UNC160 For Aluminum Castings Metal Casting Non-Destrcutive Testing Product Description: It is mainly used for non-destructive welding and inspection of a wide range of products, including metal castings, hardware, plastics, refractory materials, review materials, ceramic bodies, and metallic parts. Features: Broad Applications: Suitable for inspecting large-scale and heavy-duty items Safety Standard: Provides top-notch protection in accordance
Maszyna radiograficzna cyfrowa Unicomp UNC160 z tablicą obrotową do testowania odlewów
Unicomp Digital Radiagraphy X-Ray Machine UNC160 With Rotation Table For Castings Testing Product Description: It is primarily used for non-destructive welding and inspection of a diverse range of products, such as metal castings, hardware, plastics, refractory materials, review materials, ceramic bodies, and metallic parts. Features: Wide Range of Applications: Suitable for inspecting large-scale and heavy-duty items Safety Standard: Provides exceptional protection compliant
Maszyna rentgenowska PCB o wysokim powiększeniu Unicomp AX9100MAX do kontroli drutu wiązania komponentów elektronicznych IC
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 4 kW X-Ray Tube Tube Type Type Sealed type
Mierzenie zakrzywienia IC Unicomp AX9100MAX Maszyna rentgenowska o wielkości pikseli 84μm i kącie nachylenia 60°
It is widely utilized in applications such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, Photovoltaic Industry, and more. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 4 kW X-Ray
SMT PCB X-Ray Machine Unicomp AX9100MAX Wysokiej rozdzielczości Mikron Focus Spot Size dla BGA Voids i Inspekcji Pasty Lutowej
It finds extensive use in various fields including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, and Photovoltaic Industry, among others. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption
130KV Mikron Focus Spot Size Tube X-Ray Machine Unicomp AX9100 Zmodernizowany model AX9100MAX z podwójnymi komputerami do inspekcji PCB&BGA
It is widely applied in numerous fields such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, and Photovoltaic Industry, to name a few. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 4
Wysokie specyfikacje płyty elektroniczne 2D i 2.5D X-Ray Machine Unicomp AX9100MAX z 360 stopniami obracającymi się stołem do inspekcji BGA i PCB
It enjoys broad utilization across diverse domains including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, Small-scale Metal Casting, Electronic Connector Modules, Cables, and the Photovoltaic Industry, among others. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight
Unicomp UNC160 Urządzenia rentgenowskie do kontroli silników motocykli
Unicomp UNC160 X-Ray for Motorcycle Engine Inspection Product Description: Primarily utilized for non-destructive testing of various products such as metal castings, hardware items, plastic products, refractory materials, composite materials, ceramic bodies, and welded metal parts. Features: Widespread Applications: Large inspection size and loading weight capacity Safety Standard: High level protection with international standard, multiple safety set up Image Proccessing:
