Unicomp X Ray
Przemysłowa maszyna rentgenowska 480 W NDT 160 kV Inteligentny sprzęt do wykrywania w linii
High Resolution Effective Industrial NDT X-Ray Intelligent in-line Detection Equipment Technical Specifications Dimensions●Weight 2100mm*1720mm*2470mm(L*W*H) ●6T Power 6KW Detection speed 45s/pcs(18’’wheel) Tube voltage/Focal size 160kV/225kV ● 0.5mm/1.0mm System resolution rate ●sensitivity 3.1LP/mm●1-1.8% Work In-line continuous Work environment 5-40° ≤80%HR Power supply Three-phase five wire system AC380V X-ray leakage close rate ≤1uSv/h Image processing Brighteness and
Skaner bagażu o wysokiej precyzji rentgenowskiej 0,22 m / S do kontroli bezpieczeństwa na lotnisku
UNX6040 High Precision X Ray Baggage Scanner Airport Luggage X-ray Scanner For Security Inspection Application:Law Enforcement,Government Bodies,School,Shopping Mall, Exhibition Hall, Churches, Museum, Office Building, Campus, Hotels, Factories, Sports Center, etc. Product Features: Inspection Speed of 0.22m/s Steel penetration of 34mm Max. Inspection object size of 600*400mm Remote technical support In compliance with international safety standards, X-Ray dose rate is close
Automatyczny licznik wiórów Unicomp X Ray Inline Brak uszkodzeń Mniej pracy
Automatic Fast Speed High Accurate Inline Chip Counter X-Ray System With No Damage And Less Labor Operation Applications: Chip counting for SMT factroy, chip manufacturer Product Features: Fast speed and high accurate Chip counting,reducing labor cost One-button operation,Automatic counting . Minimum component size 01005 System Accuracy >99.8% Count time=99.8% X-ray Leakage
40-120KV Unicomp X Ray Automatyczny system odrzucania żywności Liniowy detektor Array Image System
Unicomp UNF6040 X-ray inspection system is designed for the automatic inspection of online Food, Pet Food and Pharmaceutical. The innovative “no curtain” design combined with hygienic construction makes Unicomp UNF6041 for easy and efficient cleaning where daily sanitation of equipment is mandatory. Specifiction: Model UNF6040 Max Voltage 40-120kV Max Current 0.2-7.5mA Inspection Speed (m/min) 10-50 Inspection Accuracy(mm) Stainless steel ball ø0.5,Stainless steel wire 0.2x1
Przemysł naftowy w lotnictwie Unicomp X Ray 160-350kV Kontrola NDT Wymuszone chłodzenie powietrzem
Unicomp Portable 160-350kV NDT Inspection X-Ray for Aviation / Oil Industry Below are the specification of 160kV directional X-Ray, Unicomp also supply 200kV, 250kV, 300kV, 350kV portable directional / panoramic X-Rays. Speficiations: Model Output Voltage Power Focal Size Radiation Angle Max. Penetration (A3 Fe) Dimension(mm) Weight Generator controller Generator controller XXG-1605 30-160kV 1.8 KVA 1.5*1.5mm 40+5 20mm 220*560 370*300*150 20kg 9kg Features: Sensitivity:>1.5%
Sprzęt do kontroli rentgenowskiej 2.5KVA Unicomp NDT X Ray defektoskop
Unicomp Portable NDT X-Ray Flaw Detector, X Ray Inspection for Welding / Foundry Quality Checking Except 250kV Panoramic X-Ray, Unicomp also supply 160kV, 200kV, 300kV, 350kV portable directional / panoramic X-Rays. Specifications: Output voltage: 150~250kV Tube current: 2~5mA Focus Size: 1.0×2.2mm Radiation angle: 360°*25° Photographic density: D>1.5 Maximum penetrating power : 35mm(A3 Steel) Generator Dimension: 220mm*740 mm Controller Dimension: 370mm*300mm*150 mm Power: 2
Kula ze stali nierdzewnej z pojedynczą wiązką Unicomp X Ray 40-120kV z oprogramowaniem
Max Voltage: 40-120kV Max Current: 0.2-7.5mA Dimension(WxDxH,mm): 1600x790x1800 Weight: 500kg Inspection Accuracy(mm): Stainless Steel Ball ø0.5,Stainless Steel Wire 0.2x1.5, Glass2.0,Plastic 1.5 Safety:
Flawer Detector X Ray Inspection System 0.8kW BGA dla samochodowej lampy LED
EMS Semiconductor Unicomp X-Ray Inspection System Electronics BGA AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
Oświetlenie pojazdu Unicomp X Ray 60 ° Ruch pochylenia z funkcją CNC
EMS Semiconductor Unicomp X-Ray Inspection System Electronics BGA AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework