Unicomp X Ray
Close Tube Unicomp X Ray AX9100 130kV do komponentów elektronicznych
130kV close tube X-ray Equipment AX9100 with high resolution FPD for electronics components couterfeit inspection Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum ...
IC Semiconductor Unicomp X Ray High Powiększenie Microfocus AX9100 130KV
Directly factory supply of microfocus X Ray System AX9100 with high magnification for IC Semiconductor Inspection Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum ...
Przemysł elektroniczny Unicomp X Ray 130kV AX9100 Do lutowania LED SMT PCBA
Unicomp factory supply 130kV microfocus AX9100 X-ray for SMT PCBA LED soldering void automatic measurement Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die...
Elektroniczna maszyna rentgenowska o mocy 1,2 kW 130 kV AX9100 do luki lutowniczej SMT LED QFN
130kV Microfocus AX9100 X Ray For SMT LED QFN soldering void automatic mapping and measurement Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, ...
130kV Microfocus Unicomp X Ray AX9100 Do pomiaru luk SMT LED BGA QFN
130kV Microfocus X Ray Inspection Machine Unicomp AX9100 For SMT LED BGA QFN Voids measurement Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, ...
Maszyna rentgenowska o średnicy 7um i mocy 1,2 kW do SMT BGA CSP
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: ● 130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 44.7X Geometric magnification, high-definition real-time image. ● One-button operation with 2...
Mikrofokus z zamkniętą tubą Unicomp X Ray 130kV 7um do lutowania SMT BGA
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● ...
System kontroli rentgenowskiej Unicomp Microfocus 130 kV 7um dla obrazu FPD
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● ...
BGA QFN Unicomp X Ray Inspection System 130KV z ruchem 6 osi
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Item Definition Specs System Parameters Size 1280(L)x1510(W)x1700(H)mm Weight 1750kg Power 220AC/50Hz Power Consumption 1.2kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 65W ...
