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Jakość Chip Counter BGA X Ray Inspection Machine Micro BGA On Chop Analysis fabryka

Chip Counter BGA X Ray Inspection Machine Micro BGA On Chop Analysis

Chip Counter BGA X Ray Inspection Machine Micro BGA on chop analysis​ X-ray detection technology for the SMT production testing means brought new changes, it can be said that it is the desire to further improve the level of production technology to improve the quality of production, and will soon find the circuit assembly failure as a breakthrough. It's the best selection for the manufacturer. OUR SERVICE 1.Your inquiry will be replied in 12 hours. 2.Original Manufacture to

Jakość ERP 1.1kW SMD Chip Components Licznik do produkcji SMT fabryka

ERP 1.1kW SMD Chip Components Licznik do produkcji SMT

Features ● Automatic inspection, no need on programs switch for different components ● Fast speed and high accurate chip counting, reducing labor costs ● No chip damage or lost with non-destructive counting ● Compatible with 7”~17” tape & reels ● Automatic link with ERP & MES System, and storage system ● Shielded cabinet protection to guarantee Safety leakage of X-ray ● Fast counting Speed:12~13s/Reel ● Inspection Accuracy: ≥99.9% ● Min. Package: 01005 ● One-button operation,

Jakość System kontroli rentgenowskiej 90KV 5um microfocus z zamkniętą tubą z FPD o wysokiej rozdzielczości do lutowania PCBA fabryka

System kontroli rentgenowskiej 90KV 5um microfocus z zamkniętą tubą z FPD o wysokiej rozdzielczości do lutowania PCBA

90KV 5um microfocus closed tube X-ray Inspection System with high resolution FPD for PCBA soldering void Defects checki Application Fields of X-ray machine Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features of X-ray machie 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD

Jakość Unicomp X-ray AX8300 Plus Semiconductor Microfocus X-ray Inspection Equipment fabryka

Unicomp X-ray AX8300 Plus Semiconductor Microfocus X-ray Inspection Equipment

Unicomp X-ray AX8300 Plus Semiconductor Microfocus X-ray Inspection Equipment Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features 1. Dedicated semiconductor, resolution 2 µm 2. Large detection range, batch detection efficiency 3. Double rocker design easy to operate 4. Compatible with 2D, 2.5D, Extensible 3D 5. Dual screen design, multi-task parellel

Jakość Brak uszkodzeń układu scalonego Licznik wiórów X Ray Rozmiar tunelu 440 mm Automatyczne zliczanie przy trybie liniowym fabryka

Brak uszkodzeń układu scalonego Licznik wiórów X Ray Rozmiar tunelu 440 mm Automatyczne zliczanie przy trybie liniowym

Electronic Components Counting System Production Line X-ray Counter LX6000 Manual component counting requires hours and includes the possibility of miscounts resulting in machine down-time, inaccurate inventory management, and ultimately reduced profit margins. Seamless and flexible automation means more up-time on the assembly line and increased productivity. Component counting using Unicomp X-Ray technology can take only seconds for an entire reel. Increase productivity

Jakość Wysokoprecyzyjny montaż płytek drukowanych PTH z otworami przelotowymi X-ray AX7900 Unicomp Wysoka stabilność fabryka

Wysokoprecyzyjny montaż płytek drukowanych PTH z otworami przelotowymi X-ray AX7900 Unicomp Wysoka stabilność

X-Ray Inspection Equipment AX7900 UNICOMP AX7900 is a professional high-resolution micro-focus X-ray NDT testing machine for SMT production, semiconductor packaging and new energy battery quality inspection. Built with proprietary self-developed X-ray source and high-sensitivity digital imaging detector, it clearly visualizes invisible internal defects of electronic devices. It precisely detects BGA solder voids, interlayer separation of PCB boards, chip bonding defects,

Jakość 99,8% dokładności kontroli Licznik promieniowania X Szybkość dzięki możliwości liczenia 01005 fabryka

99,8% dokładności kontroli Licznik promieniowania X Szybkość dzięki możliwości liczenia 01005

Electronic Components Counting System Production Line X-ray Counter LX6000 Manual component counting requires hours and includes the possibility of miscounts resulting in machine down-time, inaccurate inventory management, and ultimately reduced profit margins. Seamless and flexible automation means more up-time on the assembly line and increased productivity. Component counting using Unicomp X-Ray technology can take only seconds for an entire reel. Increase productivity

Jakość 0,1 m / s Automatyczny licznik wiórów SMD X Ray Rozmiar tunelu 440 mm do kontroli dużych bębnów fabryka

0,1 m / s Automatyczny licznik wiórów SMD X Ray Rozmiar tunelu 440 mm do kontroli dużych bębnów

Electronic Components Counting System Production Line X-ray Counter LX6000 Manual component counting requires hours and includes the possibility of miscounts resulting in machine down-time, inaccurate inventory management, and ultimately reduced profit margins. Seamless and flexible automation means more up-time on the assembly line and increased productivity. Component counting using Unicomp X-Ray technology can take only seconds for an entire reel. Increase productivity

Jakość Auto Online X-ray Component Reel Counter High Prescision One Button Operation fabryka

Auto Online X-ray Component Reel Counter High Prescision One Button Operation

Electronic Components Counting System Production Line X-ray Counter LX6000 Manual component counting requires hours and includes the possibility of miscounts resulting in machine down-time, inaccurate inventory management, and ultimately reduced profit margins. Seamless and flexible automation means more up-time on the assembly line and increased productivity. Component counting using Unicomp X-Ray technology can take only seconds for an entire reel. Increase productivity