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System kontroli rentgenowskiej FPD 90KV do wykrywania defektów PCBA Unicomp AX7900
FPD 90KV X Ray Inspection System for PCBA defect Detection APPLICATION of X-ray machine AX7900: LED, SMT, BGA, CSP, Flip Chip Inspection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die Casting, Moulding Plastic. Ceramics, Other Special Industries Technical Specifications of AX7900 Item Definition Specs System Parameters Size 1100(L)x1100(W)x1500(H)mm Weight 1000kg Power 220AC/50Hz Power Consumption
FPD 90KV Sprzęt do kontroli rentgenowskiej do wykrywania wad wiązek przewodów
FPD 90KV X Ray Inspection System for Wire Harness defects Detection Description of IC X-Ray machine AX7900: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading area
Wykrywanie jakości wiązek przewodów AX7900 Electronics Unicomp X Ray Equipment
Wire Harness Quality Detection AX7900 Electronics Unicomp X Ray Equipment Description of IC X-Ray machine AX7900: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading
Skaner X Ray do mapowania CNC AX8200 100KV Do wiązek złączy
Chinese leading X-ray Inspection System AX8200 for Connectors Harness Defects inspection with CNC MappingThe AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring
Sprzęt do kontroli półprzewodników Micro Focus X Ray Inline 2D
Factory directly supply microfocus inline 2D X-ray machine to check Electronic Semiconductor IGBT with automatic defect recognition Technical Parameters and SpecificationsSystem SummaryFootprint2595(W)×1392(D)×1992(H)mmMachine Weight1900 kg (X-Ray) / 700kg (Conveyor)Power SupplyAC 110~220V, 50/60HzPlywood Packing Size180(W)×170(D)×190(H)cm (X-Ray) 150(W)×105(D)×120(H)cm (Conveyor)Packing Weight2000kg (X-Ray) / 800kg (Conveyor)Power Consumption3.5 kWX-Ray TubeTube TypeSealedMa
Maszyna do kontroli promieni 2.5DX w czasie rzeczywistym AX7900 do wewnętrznego kondensatora elektronicznego
Real Time 2.5D X-Ray Machine AX7900 for Electronics Capacitor Inner Defects Inspection Description of AX7900: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading area
Maszyna rentgenowska 2.5D 110kv Unicomp AX8500 do kontroli jakości leadframe Semicon z automatycznym pomiarem
2.5D 110kv X ray machine Unicomp AX8500 for Semicon leadframe quality checking with auto measurment Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector
Elektronika wysokiej rozdzielczości X Ray Machine, IC LED Clips Electronic Components Detector
IC LED Clips Electronic Components Detector Electronics X Ray Machine X-ray Inspecting Features: (1) Coverage of process defects up to 97%. Inspectible defects include: Empty solder, Bridge, Solder shortage, voids, components missing, and so on. In particular, the BGA, CSP and other solder joint devices can also be checked by X-Ray. (2) Higher test coverage. It can check where the naked eye and the online test can not be checked. Such as PCBA was judged fault, suspected PCB
Rentgen Unicomp AX8300 110KV o wysokiej rozdzielczości do nieniszczącej analizy połączeń lutowniczych BGA
High Resolution Semiconductor X-Ray Inspection Machine AX8300 AX8300 adopts self-developed 110kV high-power micro-focus X-ray source with ultra-fine 2μm resolution. It supports 60° tilting & 360° rotating 2.5D omni-directional non-blind inspection, clearly identifying tiny internal defects of chips and solder joints. Our Service Commitment Response to inquiries within 12 hours Direct manufacturer pricing with competitive rates Comprehensive one-year warranty with free
