electronic inspection equipment
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Zliczanie zapasów X Ray Chip Counter Flip Chip do komponentów elektronicznych
High precision SMD X-Ray chip counter Unicomp CX7000L for electronics components inventory counting Features ● Automatic inspection, no need on programs switch for different components ● Fast speed and high accurate chip counting, reducing labor costs ● No chip damage or lost with non-destructive counting ● Compatible with 7”~17” tape & reels ● Automatic link with ERP & MES System, and storage system ● Shielded cabinet protection to guarantee Safety leakage of X-ray ● Fast
SMT PCBA Electronics X Ray Chip Counter Unicomp CX7000L Tunel 440mm
Factory directly supply of SMD Xray Chip counter Unicomp CX7000L for SMT and PCBA electronics compamy Main Configuration 1. Bar-code Scanner 2. X-ray System 3. Label Printer 4. Finger Printer Recognition System Equipment Features Footprint (W*D*H) / Machine Weight 1000 mm*1370 mm*1962 mm / 1160 kg Package Plywood Case, 110 cm*145 cm*210 cm, Total 1450 kg Power Consumption 1.1 kW Power Supply AC 110~220V (±10%) 50Hz Working Mode Off-line System Computer Operating System
5um SMT X Ray Sprzęt CNC Programowalny dla EMS BGA Voids
5um Microfocus X Ray Machine with CNC Programmable inspection For SMT EMS BGA Voids checking Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD)
Unicomp 90kV 5um z zamkniętą rurą Elektronika rentgenowska do SMT PCBA BGA
Unicomp 90kV 5um Closed Tube Electronics X Ray Machine For SMT PCBA BGA Unicomp 90kV 5um closed tube CX3000 X-ray Inspection System for SMT PCBA BGA QFN LED soldering void inspection Specification Of Desktop X-Ray machine Item Definition Specs System Parameters Size 750(L)x570(W)x890(H)mm Weight 300kg Power 220AC/50Hz Power Consumption 0.5kW X-ray Tube Type Closed Max.Voltage 100kV Max.Power 200μA Spot Size 5μm Detector Intensifier FPD X-ray Coverage 48mm x 54mm Resolution
Unicomp CX3000 Desktop Electronics Maszyna rentgenowska z tacą i tubą JEDEC na szpulę do szpuli
Electronics components couterfeit inspection with Unicomp desktop X-ray CX3000 with reel to reel, JEDEC tray and Tube Specification Of Desktop X-Ray machine Item Definition Specs System Parameters Size 750(L)x570(W)x890(H)mm Weight 300kg Power 220AC/50Hz Power Consumption 0.5kW X-ray Tube Type Closed Max.Voltage 100kV Max.Power 200μA Spot Size 5μm Detector Intensifier FPD X-ray Coverage 48mm x 54mm Resolution 208Lp/cm Work Station Max.Loading Size 200mm x 200mm Max.Inspection
AX7900 Cyfrowa maszyna rentgenowska w czasie rzeczywistym do kontroli defektów wewnętrznych przełącznika
Real Time Digital X-Ray Machine AX7900 for Switch Inner Defects Inspection APPLICATION of IC Xray machine AX7900: LED, SMT, BGA, CSP, Flip Chip Inspection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die Casting, Moulding Plastic. Ceramics, Other Special Industries Technical Specifications of AX7900 Item Definition Specs System Parameters Size 1100(L)x1100(W)x1500(H)mm Weight 1000kg Power 220AC/50Hz
System kontroli rentgenowskiej FPD 90KV do wykrywania defektów chipsetu
Wire Harness Quality Detection AX7900 Electronics Unicomp X Ray Equipment Description of IC X-Ray machine AX7900: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading
SMT Electronics X Ray System, szczelny, typ 110 Kv, lampa rentgenowska o wysokiej rozdzielczości
SMT electronics x ray machine sealed type X-ray Tube x-ray 110kv AX8300 X-ray inspection system has been widely applied to Circuit Board Inspection,Semi-Conductor Inspection and Other Applications. (Offline X - Ray series) widely used in offline detection, defect analysis, used for PCBA, packaging, ceramics, plastics, LED, and so on. Major applications: PCBA BGA/IC LED Aliminum die casting Battery connector inspecting 1. Semiconductor package 2. Electronic connector module. 3
Elektronika o dużym powiększeniu System rentgenowski do kontroli pustek BGA CSP / QFN / PoP
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection. Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Multi-function DXI image processing
