industrial inspection systems
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Mocny napięcie 160 kV UNS NDT urządzenia rentgenowskie kompleksowa jednostka inspekcji
UNS NDT X-Ray Equipment All-in-One Inspection Device Product Description: Primarily intended for non-destructive testing of various small-scale products, this equipment finds extensive application in examining metal castings, hardware components, plastic products, refractory materials, resin-based materials, composite materials, ceramic bodies, as well as welded metal parts. Its versatility ensures a comprehensive inspection process for a diverse range of small items.
Zaawansowana maszyna do badania opon rentgenowskiej NDT serii UNL DR U Type Line Array Detector
UNL Series NDT X-RAY Machine For Tire Inspection(DR) Product Description: UNL type X-ray intelligent testing equipment is a special testing equipment for automobile tires independently developed by Unicomp. Mainly used in automobile tire defect detection (tire internal foreign objects, parts do not meet requirements (missing or more), Radial cords(including open splices), cord fold, distortion, splices overlap,layer difference beyond standard,blisters or separation, radial
Urządzenie do badania promieniowania rentgenowskiego układu kierowniczego Unicomp UNZ225 225KV NDT Digital Radiography Machine For Internal Cracks
Steering knuckle X-ray inspection machine Unicomp UNZ225 225KV NDT digital radiagraphy machine for internal cracks The UNZ series is one of Unicomp Technology most popular models for aluminum casting, aerospace components and steel pipe. It offers an excellent balance of power and space sensitivity. The system can handle products up to 120cm in size while seated nicely in your failure analysis lab or busy production line. Product Features The pallet inspection platform can
Efektywny obszar wykrywania 129x129mm Urządzenia do kontroli rentgenowskiej do elektrycznej brzytwy 1280x1220x1615mm
X-Ray Inspection Equipment for Electric Razor Description of IC X Ray machine AX7900: It finds extensive application in numerous domains, encompassing BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, small-scale metal casting, electronic connector modules, cables, aerospace components, and the photovoltaic industry, among others. FEATURES of IC Xray machine AX7900: A Large-Scale Laser Pinpoint Inspection Table for Accurate Localization
Uaktualnienie do detektora płaskich paneli FPD Sprzęt do kontroli rentgenowskiej dla układów stacjonarnych z macierzą pikseli 1536*1536mm
X-Ray Inspection Equipment for IC Description of IC X Ray machine AX7900: It has extensive applications in diverse fields such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Production, Miniature Metal Casting, Electronic Connector Assemblies, Wiring, Aerospace Parts, and Photovoltaic Industry, to name a few. FEATURES of IC Xray machine AX7900: Precision Positioning Laser Pointer System Installed on a Large Inspection Table Accurate Control, CNC
Unicomp UNS160 System rentgenowski do kontroli tłoków motocykli
Unicomp UNS160 X-Ray System for Motorcycle Piston Inspection Product Description: Designed primarily for non-destructive testing of a wide variety of small-scale products, this equipment has broad applications in inspecting metal castings, hardware components, plastic items, refractory substances, resin materials, composites, ceramic bodies, and welded metallic parts. Its versatility guarantees a thorough examination process for a multitude of small items. Features:
Aparat rentgenowski Unicomp AX9100max 2400kg do inspekcji lamp MOS
Unicomp X-ray AX9100max For Internal Defect Inspection Of MOS Tube Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, and Photovoltaic Industry. Application Fields Functions and Features Inspection Image Technical Parameters and Specifications Dimensions and Appearance
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse & diode manufacturing PCB & semiconductor assembly Battery production Small metal castings Electronic connector modules & cables Photovoltaic (PV) cell inspection Application
System kontroli rentgenowskiej Unicomp zmniejsza ryzyko zanieczyszczenia obcej materii
Unicomp X-ray inspection system reduces risk of foreign matter contamination Unicomp X-ray inspection system scans for contaminants and checks for foreign bodies in dry bulk powders, baking and snack products, cereal and crackers. It detects and automatically rejects contaminants, including glass shards, metal fragments, mineral stone, and some plastic and rubber compounds. The system includes software that collects data that can be stored centrally and used with optional
