industrial inspection systems
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Wysokiej jakości maszyna do kontroli promieni rentgenowskiej Unicomp AX7900 do badań dokładności jakości BGA
High quality 90kV X ray inspection machine Unicomp AX7900 for BGA quality accuracy testing Description of IC X Ray machine AX7900: It finds widespread application in industries like BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB manufacturing, Semiconductors, Batteries, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, and Photovoltaics, among various others. FEATURES of IC Xray machine AX7900: Large Size Inspection Table Laser Pinpoint For Precise
Unicomp UNC160 Precyzyjna maszyna rentgenowska do wyrobów elektrycznych Izolatory epoksydowe System kontroli jakości
Unicomp UNC160 High-Precision X-Ray Machine for electrical products epoxy insulators Quality Inspection System Product Description Unicomp UNC160 X-Ray for detecting internal defects in brake pads. Mainly used in all kinds of metal castings, hardware products, plastic products, refractory materials, review materials, ceramic body and metal parts welding and other products for non-destructive. Features Widespread Applications: Large inspection size and loading weight capacity
Przemysłowe urządzenie ciśnieniowe z naczyniami ciśnieniowymi, system obrazowania X-ray Multi Axis Full Function
Multi-Axis Full Function NDT Pressure vessel X-Ray Inspection Digital Imaging System For over 15 years X-Ray inspecting, a division of X-Ray industries, has been committed to performing high quality NDT inspection services on our customer’s products for integrity, and reliability. We combine our highly experienced NDT inspection team with competitive pricing and fast turnaround time to provide clients in the aerospace, defense, automotive, food, power generation and other
Multi Axis NDT X Ray Equipment Cyfrowy system obrazowania z pełną funkcjonalnością
Multi-Axis Full Function Pipeline inspection Digital Imaging System X-ray flaw detection is the difference in the degree of X-ray absorption by using different thicknesses of materials. By using X-ray fluoroscopy and industrial television real-time imaging, the internal defects of materials, parts and welds are revealed from the film and the image. Such as cracks, shrinkage cavities, pores, slag inclusions, unmelted, incomplete penetration, etc., determine the location and
Pełna zamknięta osłona Promieniowanie X Orientacja NDT Sprzęt 320Kv 2.8LP / mm Rozdzielczość
Full Enclosed Shield X-ray Orientation Instrument 320Kv Inspection Equipment X-ray flaw detection is the difference in the degree of X-ray absorption by using different thicknesses of materials. By using X-ray fluoroscopy and industrial television real-time imaging, the internal defects of materials, parts and welds are revealed from the film and the image. Such as cracks, shrinkage cavities, pores, slag inclusions, unmelted, incomplete penetration, etc., determine the
Chiny Unicomp AX8200 BGA / IC / PCB Zamknięta maszyna rentgenowska z ceną fabryczną
Smt X-ray Closed 5g Chipset Electronic Connector Module Inspection Machine AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the
FPD Unicomp AX8200B Offline X Ray Machine 100kv dla ogniw litowo-jonowych
Smt X-ray Closed 5g Chipset Electronic Connector Module Inspection Machine AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the
CSP Bateria litowa X Ray Skaner Unicomp Offline Model AX8200B
Smt X-ray Closed 5g Chipset Electronic Connector Module Inspection Machine AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the
CSP Electronics X Ray Machine UNICOMP CX3000 do złącza kablowego
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 Applications BGA Inspection Inspection of over molded electrical connectors Encapsulated components Aluminum die castings Molded plastic components Ceramics Aerospace components Electrical / mechanical components Electronic components SMT assemblies Pharmaceuticals Automotive assemblies Agriculture Counterfeit inspection Cell phone battery inspection The AX-8200 machine is designed to provide high
