industrial inspection systems
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System testowy NDT AC380V X Ray Low Breakdown do kontroli prętów odlewniczych
Unicomp Technology X-ray System for Casting Prats Inspection ●High reliable and long life,low breakdown ●High definition and resolution FPD ●C-arm fixture design enabling five-axis motion detection(optional automatic lift and descend) ●Multi-functional workstation,360°rotation and shift ●User friendly software design for easy interfacing can facilitate,customized software ●High penetration,Voltage up to 450KV,Maximum penetration thickness up to 80mm for "Fe" ●Detection area:
Przemysłowe materiały wzmacniane włóknami NDT X Ray Materiały wzmocnione włóknem do kontroli części odlewanych
Excellent image quality of Unicomp Technology Industrial X-ray System for Cast Parts Inspection UNC225Π is an excellent solution for casting inspection activities of large quantity parts production as well as for R&D. From large multi-national companies to small/medium-sized foundries and global car manufacturers, all trust their inspections to this robust system. UNC225Π assists you in detection of casting flaws in items such as: Aluminum castings (engine blocks, cylinders,
Maszyna do kontroli promieniowania rentgenowskiego 225KV Unicomp UNZ225 Do części motoryzacyjnych
225KV X-Ray Inspection Machine Unicomp UNZ225 For Automotive Parts Steering Knuckle Inspection The UNZ series is one of Unicomp Technology most popular models for aluminum casting, aerospace components and steel pipe. It offers an excellent balance of power and space sensitivity. The system can handle products up to 120cm in size while seated nicely in your failure analysis lab or busy production line. SYSTEM CAPABILITIES Advanced 2D X-ray inspection Overall Maximum System
Maszyna rentgenowska PCB o wysokim powiększeniu Unicomp AX9100MAX do kontroli drutu wiązania komponentów elektronicznych IC
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 3.5 kW X-Ray Tube Tube Type Type Sealed type Max.
Wielkość punktu ostrości mikronów maszyny rentgenowskiej SMT PCB do pomiaru pustek BGA i inspekcji wysokości wspinaczki lutowniczej
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.
SMT PCB X-Ray Machine Unicomp AX9100MAX Wysokiej rozdzielczości Mikron Focus Spot Size dla BGA Voids i Inspekcji Pasty Lutowej
It finds extensive use in various fields including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, and Photovoltaic Industry, among others. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption
Urządzenie do badania jakości rentgenowskiej Unicomp AX7900 dla używanych telefonów komórkowych
High magnifications X-ray machine Unicomp AX7900 for used mobile phone quality inspection Description of IC X Ray machine AX7900: Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. FEATURES of IC Xray machine AX7900: Large Size Inspection Table Laser Pinpoint For Precise Location Accurate Control, CNC Programming Automatic
Obrazowanie głębokiej penetracji Kontrola defektów porowatości wewnętrznej Odlewanie ciśnieniowe Rentgen AX9600 Unicomp
Deep Penetration Imaging Internal Porosity Defect Checking Die Casting X-ray AX9600 Unicomp The UNICOMP AX9600 high-power micro-focus X-ray inspection system delivers ultra-precision non-destructive testing for advanced semiconductor and electronic components, featuring deep penetration imaging for internal porosity and defect detection in die casting applications. Applications Specifically designed for high-end semiconductor and electronic component inspection, the AX9600
Niskie gęstości metalu Ndt X Ray Equipment 160KV z przyjaznym dla użytkownika interfejsem oprogramowania
Low Density Metal Nondestructive Material Testing NDT X Ray 160KV Unicomp Technology UNC series NDT X ray real time imaging detection equipment is the standardized one for industrial NDT. Unicomp has rich experience in the design of NDT X-ray and solution of detection technology to help customers to achieve non-destructive testing in manufacturing process, research, project development and testing services, and ensure product quality. The technology and equipment are widely
