industrial x ray systems
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Unicomp UNC320 Urządzenie do kontroli rentgenowskiej odlewów ciśnieniowych lotniczych
Unicomp UNC320 X-Ray Inspecting Aerospace Die Castings for Hidden Defects Product Description: Centered mainly on non-destructive testing, this methodology is widely utilized across a diverse range of products, including metal castings, hardware parts, plastic items, refractory materials, resin-based materials, composites, ceramics, and various welded metal components, among others. It guarantees the quality and reliability of these materials and components without causing
Zaawansowane urządzenia do kontroli promieniowania rentgenowskiego dla przemysłu elektronicznego 1000 kg maksymalne obciążenie
X-Ray Inspection Equipment for Electronics Description of IC X Ray machine AX7900: Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. APPLICATION of IC Xray machine AX7900: Large Size Inspection Table,Laser Pinpoint For Precise Location Accurate Control, CNC Programming,Automatic Positioning FPD Tilting ±25° Safely Electromag
225KV napięcie Unicomp UNC320 rentgen do wykrywania usterek wewnętrznych uchwytów samochodowych 7500kg Maszyna
Unicomp UNC320 X-Ray for detecting internal defects in Car Bracket Product Description: This technique, which primarily focuses on non-destructive testing, is widely employed for a diverse range of products, including metal castings, hardware components, plastic items, refractory materials, resin materials, composites, ceramics, and various welded metal parts, among others. It guarantees the quality and integrity of these materials and components without causing any harm or
Wykrywanie usterek wewnętrznych w uchwytach samochodowych za pomocą rentgenowego Unicomp UNC320
Detect Internal Flaws in Car Bracket with Unicomp UNC320 X-Ray Product Description: This non-destructive testing technique is broadly applied to a variety of products, such as metal castings, hardware parts, plastic goods, refractory substances, resin materials, composites, ceramics, and multiple welded metal components, among others. It ensures the quality and structural integrity of these materials and components without inflicting any damage or modifying their original
Unicomp AX9180 180kV Mikrofokusowa rentgenowska maszyna elektroniczna z FPD ukośnym
Unicomp AX9180: Mikrofokus 180 kV z plamką o wielkości 10 μm, nachyleniem 60° i 7-osiowym połączeniem. FPD o wysokiej rozdzielczości zapewnia powiększenie 1000X dla precyzyjnej kontroli PCB, BGA i półprzewodników. Obejmuje roczną gwarancję i programowanie offline.
Wysoka precyzja ruchu 5 µm Mikroogniskowe rentgenowskie urządzenie do kontroli jakości elektroniki BGA QFN AX7900 Unicomp
High Motion Precision 5μm Micro Focus BGA QFN Electronics X-ray Equipment AX7900 Automatic X-ray Mapping Inspection for IC Electronics Components Advanced X-ray inspection system for internal quality assessment and counterfeit detection of electronic components. System Overview The AX7900 features a 90KV 5μm X-ray tube with FPD detector, multi-function workstation, and comprehensive motion control system. The system includes XY multi-axis movement with ±60° tilt motion option
CX3000 Electronics PCBA Unicomp X Ray Detection Machine, Benchtop X Ray Machine
CX3000 Benchtop Electronics PCBA Unicomp X-ray Detection Equipment Features: 1. 5μm 100kV X-ray tube; 2. Dynamic FPD with high-resolution of 1000×1124; 3. Equipped with 360° rotary fixture to eliminate PoP shadow; 4. The detection area easily positioned by external rocker; 5. Inspection & Analysis of soldering joint and materials inner structure; 6. High safety with seamless lead welding, interlock and emergency button. Applications: BGA , CSP , LED , Flip Chip , Semiconducto
Sprzęt do elektronicznego wykrywania promieniowania wysokiej mocy Elektronika SMT BGA Semiconductor
High Power X-ray Detection Equipment Electronics SMT BGA Semiconductor Today, Unicomp Technology has three R&D /Manufacturing sites exceeding 25,000m2 respectively located at Wuxi/Jiangsu Province, Shenzhen/Guangdong Province, and Chongqing. Our sales and service centers are located all across China including Beijing, Shenyang, Tianjin, Xi'an, Qingdao, Wuhan, Chengdu, Ningbo , Xiamen and etc. The company has also penetrated into the international market with sales and service
Elektronika Unicom X-Ray Machine do wykrywania defektów na półprzewodnikowych powierzchniach płytek
EMS Semiconductor Unicomp PCB X Ray Machine for Electronics BGA AX8200 X-ray inspection system has been widely applied to Circuit Board Inspection,Semi-Conductor Inspection and Other Applications. (Offline X - Ray series) widely used in offline detection, defect analysis, used for PCBA, packaging, ceramics, plastics, LED, and so on. The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is
