industrial x ray systems
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160KV Real Time Industrial NDT system promieniowania rentgenowskiego do odlewów z aluminium z certyfikatem CE/FCC
NDT UNS160 X Ray Equipment Applications of NDT X-ray Machine UNS 160-A : various types of metal castings hardware products plastic products refractory materials resin materials review conduct non-destructive testing on various small and micro products such as materials FAQ: 1. How about the package? Is it safe during the delivery? All X-ray inspection machine is packed with standard wooden solid carton. It is safe when shipping. 2. Do you provide the Warranty? How about the
Urządzenie do badania promieniowania rentgenowskiego układu kierowniczego Unicomp UNZ225 225KV NDT Digital Radiography Machine For Internal Cracks
Steering knuckle X-ray inspection machine Unicomp UNZ225 225KV NDT digital radiagraphy machine for internal cracks The UNZ series is one of Unicomp Technology most popular models for aluminum casting, aerospace components and steel pipe. It offers an excellent balance of power and space sensitivity. The system can handle products up to 120cm in size while seated nicely in your failure analysis lab or busy production line. Product Features The pallet inspection platform can
Wysokiej dokładności inteligentny system skanera rentgenowskiego żywności Unicomp UNX6030N dla dużych opakowań żywności
High accuracy intelligent food X-ray scanner system Unicomp UNX6030N for big packaged nutrition food APPLICATION UNX6030-N is used to detect foreign matter contaminants in small bags for lightweights products. Such as candy, fresh meat, prawn, vegetable, poultry, chocolates, candy, pasta, instant noodles, bread, biscuits, dried fish, ham sausage, beef jerky, nuts, etc. FEATURES Easy to Operate: one button start&stop, optional default product Provide high precision automatic
Unicomp UNX6030N Żywność X-Ray Steel Detector Maszyna sprawdza obce obiekty jak stal, ceramika, kamień, kości, szkło
Unicomp UNX6030N food X ray steel detector machine inspect the foreign objects as steel,ceramic,stone,bones,glass APPLICATION The UNX6030-N is employed for detecting contaminants in the form of foreign matter within small packages containing lightweight products, including candies, fresh meat, prawns, vegetables, poultry, chocolates, pastries, instant noodles, bread, biscuits, dried fish, ham sausage, beef jerky, nuts, and more. FEATURES User-Friendly Operation: Features a
Maszyna rentgenowska PCB o wysokim powiększeniu Unicomp AX9100MAX do kontroli drutu wiązania komponentów elektronicznych IC
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 4 kW X-Ray Tube Tube Type Type Sealed type
Mierzenie zakrzywienia IC Unicomp AX9100MAX Maszyna rentgenowska o wielkości pikseli 84μm i kącie nachylenia 60°
It is widely utilized in applications such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, Photovoltaic Industry, and more. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 4 kW X-Ray
SMT PCB X-Ray Machine Unicomp AX9100MAX Wysokiej rozdzielczości Mikron Focus Spot Size dla BGA Voids i Inspekcji Pasty Lutowej
It finds extensive use in various fields including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, and Photovoltaic Industry, among others. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption
130KV Mikron Focus Spot Size Tube X-Ray Machine Unicomp AX9100 Zmodernizowany model AX9100MAX z podwójnymi komputerami do inspekcji PCB&BGA
It is widely applied in numerous fields such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, and Photovoltaic Industry, to name a few. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 4
90KV Mikron Focus Spot Size Tube X-Ray Machine Unicomp Zmodernizowany Model AX7900 Z Podwójnymi Komputerami Do Sprawdzania Jakości Komórki
90KV micron focus spot size tube X-ray machine Unicomp upgraded model AX7900 with dual computers for checking the cellphone quality Description of IC X Ray machine AX7900: It has broad applications spanning BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, small metal casting, electronic connector modules, cables, aerospace parts, and the photovoltaic industry, among other fields. FEATURES of IC Xray machine AX7900: Laser Pinpoint Inspection
