pcb x ray inspection
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Mierzenie zakrzywienia IC Unicomp AX9100MAX Maszyna rentgenowska o wielkości pikseli 84μm i kącie nachylenia 60°
It is widely utilized in applications such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, Photovoltaic Industry, and more. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 4 kW X-Ray
Aparat rentgenowski Unicomp AX9100max 2400kg do inspekcji lamp MOS
Unicomp X-ray AX9100max For Internal Defect Inspection Of MOS Tube Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, and Photovoltaic Industry. Application Fields Functions and Features Inspection Image Technical Parameters and Specifications Dimensions and Appearance
Elektronika lutownicza LED Strip System rentgenowski Wykrywanie defektów pustych Tryb sterowania CNC
LED Strip Soldering Quality / Void Flaw Detection X-Ray Machine Specifications Item Definition Specs System Parameters Size 1385(L)x1400(W)x1620(H)mm Weight 2000kg Power 220AC/50Hz Power Consumption 3.5kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 3μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 200 X Detection Region Orbit Adjusting Range 80-350mm X-ray Leakage
AX9100max Elektronika X-Ray Machine z stałym punktem śledzenia podczas nachylenia FPD
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 3.5 kW X-Ray Tube Tube Type Type Sealed type Max.
Unicomp AX9100max X-ray Machine 130kV For IGBT Testing
Unicomp AX9100max X-ray Machine 130kV For IGBT Testing The Unicomp AX9100max X-ray Machine is designed for IGBT inspection and widely applied in various industries including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, and Photovoltaic Industry. Application Fields Functions and Features Inspection Image Technical Parameters and Specifications Dimensions and Appearance
AC 110-220V Elektronika X Ray Maszyna Wszechstronny system Flip Chip, COB
Electronics X Ray Machine for BGA , CSP , LED , Flip Chip , Semiconductor OUR SERVICE 1. Your inquiry will be replied in 12 hours. 2. Original Manufacture to customers, with competitive price. 3. We provide one year warranty, free training and whole life technology support. 4. We can arrange the shipment by air, DHL,Fedex, UPS, and by Sea,etc for you, and will give you the tracking NO. after shipment. 5. Well-trained and Professional after-sales service team to support you. 6
Maszyna rentgenowska Unicomp AX9100max do komórek cylindrycznych
Unicomp AX9100max X-ray Machine For Cylindrical Cell Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, and Photovoltaic Industry. Application Fields Functions and Features Inspection Image Technical Parameters and Specifications Dimensions and Appearance
Wysokoprecyzyjny montaż płytek drukowanych PTH z otworami przelotowymi X-ray AX7900 Unicomp Wysoka stabilność
X-Ray Inspection Equipment AX7900 UNICOMP AX7900 is a professional high-resolution micro-focus X-ray NDT testing machine for SMT production, semiconductor packaging and new energy battery quality inspection. Built with proprietary self-developed X-ray source and high-sensitivity digital imaging detector, it clearly visualizes invisible internal defects of electronic devices. It precisely detects BGA solder voids, interlayer separation of PCB boards, chip bonding defects,
Maszyna radiograficzna cyfrowa i maszyna rentgenowska Unicomp AX7900 do naprawy PCB oraz pomiaru i testowania lutowania kulkowego IC/BGA
Digital Radiography machine & x ray machine Unicomp AX7900 for pcb repair and IC/BGA ball soldering measurement&testing Description of IC X Ray machine AX7900: It is widely adopted across multiple industries, including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB manufacturing, Semiconductor production, Batteries, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, and Photovoltaics. FEATURES of IC Xray machine AX7900: Large Size Inspection Table
