Elektronika X Ray Machine
Maszyna do kontroli rentgenowskiej 5μm z ogniskową PCBA platerowaną przez otwór AX8300 Unicomp PTH Detektor wad pustych
5μm Focus Spot PCBA Plated Through Hole X-ray Inspection Machine AX8300 The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV micro-focus X-ray ...
Przemysłowa maszyna do kontroli rentgenowskiej 90KV AX7900 do lutowania koralików LED i pęknięć przewodów UNICOMP
90KV Industrial X-ray Inspection Machine AX7900 for LED Lamp Bead Solder Void and Wire Breakage UNICOMP Product Overview The AX7900 industrial X-ray inspection system features a high-performance 90kV X-ray tube with 5μm ultra-high resolution and a high-sensitivity FPD flat-panel detector. Built with ...
Przemysłowa maszyna do kontroli rentgenowskiej 110KV do analizy pustki lutowniczej IGBT UNICOMP AX8300MAX
110KV Industrial X-ray Inspection Machine for IGBT Solder Voiding Analysis UNICOMP AX8300MAX This advanced industrial X-ray inspection system is specifically designed for precision analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial ...
Maszyna do kontroli rentgenowskiej 160KV z mikroogniskiem do łączenia drutów półprzewodnikowych NDT AX9600 Unicomp
160KV Microfocus X-ray Inspection Machine for Semiconductor Wire Bonding NDT AX9600 Unicomp The UNICOMP AX9600 160KV microfocus X-ray inspection system is equipped with a proprietary 160kV high-power open-type microfocus X-ray tube, achieving an ultra-fine focal spot of merely 0.8 μm. Supporting a ...
Skanowanie pod kątem 60° pod wieloma kątami Wykrywanie ukrytych defektów lutowania PCBA BGA X-ray AX9100 UNICOMP Półmaszyna testująca
60° Tilt Multi-angle Scan Hidden Solder Defect Detection PCBA BGA X-ray AX9100 UNICOMP Semi Testing Machine Advanced X-ray inspection system designed for comprehensive defect detection in electronic components and industrial applications. Key Features 130KV 7μm X-Ray tube for precise imaging High ...
90kV 5μm rozdzielczość Włókna wiązania półprzewodnika X-ray Tester CX3000 Unicomp Złota urządzenia kontroli wiązania
CX300 Unicomp Gold Bond Inspection Equipment 90kV 5μm Resolution Bonding Wire Semiconductor X-ray Tester for precise inspection and quality control. Applications BGA, CSP, LED, Flip Chip, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Aerospace Components, ...
Obrazowanie 2,5D w wysokiej rozdzielczości Nakładająca się pustka BGA X-ray AX9100 UNICOMP SMT Sprzęt do kontroli montażu
High Definition 2.5D Imaging Overlapped Void BGA X-ray AX9100 UNICOMP SMT Assembly Inspection Equipment Product Overview The Unicomp AX9100 represents advanced X-ray inspection technology for comprehensive SMT assembly quality control, featuring high-definition 2.5D imaging and specialized void ...
Kontrola połączeń lutowanych BGA Void UNICOMP AX8300 System rentgenowski do zapewnienia jakości produkcji PCBA
SMT electronics x ray machine sealed type X-ray Tube x-ray 110kv AX8300 X-ray inspection system has been widely applied to Circuit Board Inspection,Semi-Conductor Inspection and Other Applications. (Offline X - Ray series) widely used in offline detection, defect analysis, used for PCBA, packaging, ...
Obrót o 360° CNC Automatyczny montaż PCB MOSFET System kontroli Xray AX8300MAX Unicomp Stabilna wydajność
Tilt BGA Solder Joint Electronics Xray Inspection Machine AX8300MAX Unicomp Auto Void Analysis Application This system is widely applicable to semiconductor packaging (BGA, CSP, LED, Flip Chip), automotive parts, new energy industry components, aluminum die castings, injection molded plastics, ...
